Abstract: A slot-type processor and one or more cache modules are incorporated into a vertically oriented, multiple chip module (CM) that is mounted to a printed circuit board. The MCM operates at ultra high frequencies and very high temperatures. Each component of the MCM has a heatsink, a thermal plate, and a series of mounting clips and screws which combine to dissipate heat. The heatsinks and thermal plates generate most of the electromagnetic interference (EMI) since they are not attached or grounded to the board. A series of alignment posts extend from the board and are used to individually and slidably mount each of the components to the board. Each thermal plate is grounded to the posts with grounding clips. The clips maintain contact with the thermal plate through wiping elements. Additional pressure is applied to the wiping elements through a post retaining bracket. The components are fully seated and retained in position with retaining cams.

Abstract: A flexible electrical contact is formed as a convex dome structure extending from one side of a surrounding structure, with the convex dome structure and the surrounding structure forming an integral metallic structure. The convex dome structure includes a central contact portion and a number of legs extending between the central contact portion and the surrounding structure. Each leg extends radially outward from the central contact portion and circumferentially around part of the central contact portion. A number of convex dome structures of this kind may be part of a removable shield in an electronic enclosure, provided to electrically ground the shield to a conductive frame, reducing the level of RFI (radio frequency interference) emissions from a device. Alternately, a number of convex dome structures may be provided along spring strips fastened to such a shield. In such spring strips, electrical contact may occur between the shield and intermediate positions along the length of the legs.