Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 ?m2 to about 1965 ?m2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 ?m2 to about 1965 ?m2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

Abstract: An improved aerogel and a process for production of the same. The improved aerogel which has a significantly reduced dust (e.g., aerogel fines) and static charge, as compared with conventional aerogel products. The aerogel also has a “sticky” or “tacky” nature which can be used to attract any available dust, fines and/or particulate matter and also restrict flowability of aerogel granules, for example, out of a breached container and thereby minimize loss of the aerogel product through any breached opening.

Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 ?m2 to about 1965 ?m2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a polyphenylene ether, a halogen-free or substantially halogen-free polyepoxide, and one or more phosphorated compounds. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a polyphenylene ether, a halogen-free or substantially halogen-free polyepoxide, and one or more phosphorated compounds. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

Abstract: A novel capacitor foil and printed circuit board intermediate made using that foil are disclosed. The capacitor foil is a two-layer construction having a conductive layer and a partially cured bonding layer having a high dielectric constant. The high dielectric bonding layer is formed with epoxy or other polymer and is loaded with capacitive ceramic particles or pre-fired ceramic forming particles. The resulting capacitor foil may be applied to a laminate having copper patterns thereon to define a PCB intermediate containing at least one buried capacitor device. Multiple layers of capacitance material also can be used to increase the overall capacitance of the board.

Abstract: A method for measuring the degree of cure of a resin in a composite material such as a prepreg. The method employs an infrared spectrometer device determining frequency absorbance information of selective frequencies which are representative of the degree of cure of the resin comprised within the prepreg. The method is adaptable for use in on-line production processes for the production of such composite materials.

Abstract: Homogeneous thermoset copolymers which may be used in the preparation of laminates for circuitry boards will comprise a poly(vinyl benzyl ether) of a polyphenol and a polyalkadiene in which the alkadiene monomer will contain from 3 to about 8 carbon atoms. The polymers are prepared by admixing a solution of the poly(vinyl benzyl ether) of a polyphenol dissolved in an organic solvent with a solution of the polyalkadiene also dissolved in an organic solvent. The admixing is done at an elevated temperature to form the desired composite. The resulting copolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.

Abstract: Novel compositions of matter comprise homogeneous thermoset copolymers resulting from the reaction between a poly(vinyl benzyl ether) of a polyphenol and a dicyanate ester of a polyether of a polyphenol may be used as components in laminates which are employed in electronic circuit boards. The copolymers will impart desirable characteristics such as high glass transition temperatures and low dielectric constants to the finished product.