Abstract: A surface mount semiconductor diode device (50) having first (51) and second (53) coplanar contacts comprises a semiconductor element (52) having a first surface electrically mounted on a first member (54) formed of conductive material, which first member (54) has an arm (58) extending in a direction away from the semiconductor element (52) to an end (60) which forms the first contact (51). A cup member (62) formed of conductive material comprises a wall (64) extending from a bottom portion (66) so as to form an opening (68) surrounded by the wall (64). The semiconductor element (52) and first member (54) are mounted within the opening (68) such that a second surface of the semiconductor element (52) is electrically coupled to the bottom portion (66) of the cup member (62) and the end of the arm (58) extends above a top surface (72) of the wall (64).

Abstract: A rectifier (60) is formedf by soldering a diode chip (66) in a cavity (64) in a metal base (62) having a metal sidewall (69), soldering the head (72) of an axial lead (70) to the chip (66), and filling the cavity (64) with an encapsulation (88). An outward leaning partition (80) is provided in the cavity (64) around and at about the same elevation as the chip (66). The encapsulation (88) covers the lead head (72) and the partition (80), and fills the space between the partition (80) and the base sidewall (69). This locks all the parts together, giving improved reliability and lead stiffnes at low cost.