Patents by Inventor William D. Weber
William D. Weber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11922526Abstract: Aspects of distributed ledger technology are leveraged to verify subrogation settlements. In particular, two parties to a subrogation claim provide cryptographic hashes to a subrogation demand smart contract stored at an address on a blockchain. The subrogation demand smart contract determines that the parties have reached an agreement by determining that the cryptographic hashes match. A settlement amount from the subrogation claim may be appended to a set of settlement amounts to determine a net settlement amount to facilitate a single payment between the parties on a periodic basis, such as daily, to alleviate the need for the parties to send or receive a payment for each individual settlement amount.Type: GrantFiled: August 26, 2022Date of Patent: March 5, 2024Assignee: STATE FARM MUTUAL AUTOMOBILE INSURANCE COMPANYInventors: Ryan Maurer, Nolan White, Kyle D. Weber, Edward Austin, William Guthrie, Dustin Helland, Bharat Prasad, Sharon Kay Haverlah, Karen Marie Shackelford-George
-
Patent number: 11635688Abstract: The present invention is directed to a permanent photoimageable compositions and the cured products thereof useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more alkali soluble, film forming resins or one or more film forming resins that become soluble in alkali solutions by action of an acid, (B) one or more cationic photoinitiators, (C) one or more film casting solvents, and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed compositions.Type: GrantFiled: March 4, 2013Date of Patent: April 25, 2023Assignee: KAYAKU ADVANCED MATERIALS, INC.Inventors: Daniel J. Nawrocki, Jeremy V. Golden, Milton O. Bernal, William D. Weber
-
Patent number: 9519216Abstract: The present disclosure relates to compositions that include at least one polybenzoxazole precursor polymer, at least one photoacid generator, and at least one basic compound. Articles, films, and methods related to these compositions are also disclosed.Type: GrantFiled: January 30, 2009Date of Patent: December 13, 2016Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Ahmad A. Naiini, Il'ya Rushkin, William D. Weber, Donald W. Racicot
-
Publication number: 20150024326Abstract: The present invention is directed to a permanent photoimageable compositions and the cured products thereof useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more alkali soluble, film forming resins or one or more film forming resins that become soluble in alkali solutions by action of an acid, (B) one or more cationic photoinitiators, (C) one or more film casting solvents, and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed compositions.Type: ApplicationFiled: March 4, 2013Publication date: January 22, 2015Inventors: Daniel J. Nawrocki, Jeremy V. Golden, Milton O. Bernal, William D. Weber
-
EPOXY FORMULATIONS AND PROCESSES FOR FABRICATION OF RELIEF PATTERNS ON LOW SURFACE ENERGY SUBSTRATES
Publication number: 20140302430Abstract: The present invention is directed to a permanent epoxy photoresist composition useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more epoxy resins according to Formulas I-VI, (B) one or more cationic photoinitiators; (C) one or more film casting solvents; and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed composition.Type: ApplicationFiled: September 5, 2012Publication date: October 9, 2014Applicant: Microchem Corp.Inventors: Daniel J. Nawrocki, Jeremy V. Golden, William D. Weber -
Patent number: 7803510Abstract: A heat resistant positive-working photosensitive PBO precursor composition comprising: (a) at least one polybenzoxazole precursor polymer; (a) at least one plasticizer compound; (b) at least one solvent; wherein the amount of the plasticizer present in the composition is an amount effective to reduce the sidewall angle of imaged and cured features in the coated film on the substrate to prevent stress failures in subsequent metallization of the substrate due to steep angles of the imaged features, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety on the polymer, then (c) at least one photoactive compound is also present in the composition.Type: GrantFiled: August 7, 2006Date of Patent: September 28, 2010Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Ahmad A. Naiini, David B. Powell, Donald W. Racicot, Il'ya Rushkin, William D. Weber
-
Patent number: 7449280Abstract: A photoimagable composition suitable for use as a negative photoresist comprising: (A) at least one epoxidized polyfunctional bisphenol A formaldehyde novolak resin; (B) at least one polycaprolactone polyol reactive diluent, wherein the amount of component (A) is from about 95% to about 75% by weight of the sum of (A) and (B) and the amount of component (B) is from about 5% to about 25% by weight of the sum of (A) and (B); (C) at least one photoacid generator in an amount from about 2.5 to about 12.5 parts per hundred parts of resin and reactive diluent, which initiates polymerization upon exposure to actinic radiation; and (D) a sufficient amount of solvent to dissolve (A), (B) and (C); wherein the solvent comprises 2-pentanone, 3-pentanone, and 1,3-dioxolane and mixtures thereof.Type: GrantFiled: September 20, 2004Date of Patent: November 11, 2008Assignees: MicroChem Corp., Hewlett-Packard Development Company, LPInventors: Donald W. Johnson, William D. Weber, Pamela J. Waterson, Vincent R. Urdi, Joseph R. Molea, Thomas Roger Strand
-
Patent number: 7335319Abstract: An edge bead remover composition that includes at least one ketone selected from the group consisting of: wherein R1 and R2 are independently selected from the group consisting of: methyl, ethyl, n-propyl, n-butyl, sec-butyl, and isobutyl, and wherein n equals 1 or 2; at least one ester other than lactones; and at least one lactone.Type: GrantFiled: February 6, 2003Date of Patent: February 26, 2008Assignee: Arch Specialty Chemicals, Inc.Inventors: Laurie J. Peterson, Richard L. Hopla, Ahmad A. Naiini, William D. Weber, Pamela J. Waterson
-
Patent number: 7195849Abstract: A positive photosensitive resin composition comprising: (a) at least one polybenzoxazole precursor polymer having structure I or II; (b) at least one photosensitive compound selected from compounds described by structures III–V, (c) at least one solvent; and (d) optionally an adhesion promoter.Type: GrantFiled: March 4, 2004Date of Patent: March 27, 2007Assignee: Arch Specialty Chemicals, Inc.Inventors: Ahmad A. Naiini, Pamela J. Waterson, William D. Weber, Ilya Rushkin, Richard Hopla, Jon Metivier
-
Patent number: 7132205Abstract: An end-capped polybenzoxazole precursor having acid labile functional groups, positive working photosensitive compositions thereof and use of the compositions for producing heat resistant relief images on substrates.Type: GrantFiled: June 3, 2004Date of Patent: November 7, 2006Assignee: Arch Specialty Chemicals, Inc.Inventors: Ilya Rushkin, Ahmad A. Naiini, Richard Hopla, Pamela J. Waterson, William D. Weber
-
Patent number: 7129011Abstract: A heat resistant negative working photosensitive composition that comprises (a) one or more polybenzoxazole precursor polymers (I): ?wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar1 is a tetravalent aromatic group, a tetravalent heterocyclic group, or mixtures thereof; Ar2 is a divalent aromatic, a divalent heterocyclic, a divalent alicyclic, or a divalent aliphatic group that may contain silicon; Ar3 is a divalent aromatic group, a divalent aliphatic group, a divalent heterocyclic group, or mixtures thereof; Ar4 is Ar1 (OH)2 or Ar2; G is a monovalent organic group a carbonyl, carbonyloxy or sulfonyl group; (b) one or more photo-active compounds which release acid upon irradiation (PAGs); (c) one or more latent crosslinkers each of which contains at least two ˜N—(CH2OR)n units (n=1 or 2, wherein R is a linear or branched C1–C8 alkyl group); (d) at least one solvent, and (e) at least one dissolution rate modifier, withType: GrantFiled: June 3, 2004Date of Patent: October 31, 2006Assignee: Arch Specialty Chemicals, Inc.Inventors: Ilya Rushkin, Ahmad A. Naiini, Richard Hopla, Pamela J. Waterson, William D. Weber, David B. Powell
-
Patent number: 7056641Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.Type: GrantFiled: July 8, 2005Date of Patent: June 6, 2006Assignee: Arch Specialty Chemicals, Inc.Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu
-
Patent number: 7018776Abstract: Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images.Type: GrantFiled: December 10, 2003Date of Patent: March 28, 2006Assignee: Arch Specialty Chemicals, Inc.Inventors: Ilya Rushkin, Ahmad A. Naiini, William D. Weber, Don Perry, Richard Hopla
-
Patent number: 6939659Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.Type: GrantFiled: March 4, 2004Date of Patent: September 6, 2005Assignee: Arch Specialty Chemicals, Inc.Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu
-
Patent number: 6929891Abstract: A heat resistant negative working photosensitive composition that comprises (a) one or more polybenzoxazole precursor polymers (I): wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar1 is selected from the group consisting of a tetravalent aromatic group, a tetravalent heterocyclic group, or mixtures thereof; Ar2 is selected from the group consisting a divalent aromatic, a divalent heterocyclic, a divalent alicyclic, a divalent aliphatic group that may contain silicon, or mixtures thereof; Ar3 is selected from the group consisting a divalent aromatic group, a divalent aliphatic group, a divalent heterocyclic group, or mixtures thereof; Ar4 is selected from the group consisting Ar1 (OH)2 or Ar2; G is an organic group selected from the group consisting groups having a carbonyl, carbonyloxy or sulfonyl group attached directly to the terminal NH group of the polymer; (b) one or more photo-active compounds which release acid upon irrType: GrantFiled: March 8, 2004Date of Patent: August 16, 2005Assignee: Arch Specialty Chemicals, Inc.Inventors: Ilya Rushkin, Ahmad A. Naiini, Richard Hopla, Pamela J. Waterson, William D. Weber
-
Publication number: 20040253542Abstract: An end-capped polybenzoxazole precursor having acid labile functional groups, positive working photosensitive compositions thereof and use of the compositions for producing heat resistant relief images on substrates.Type: ApplicationFiled: June 3, 2004Publication date: December 16, 2004Applicant: Arch Specialty Chemicals, Inc.Inventors: Ilya Rushkin, Ahmad A. Naiini, Richard Hopla, Pamela J. Waterson, William D. Weber
-
Publication number: 20040253537Abstract: A heat resistant negative working photosensitive composition that comprisesType: ApplicationFiled: June 3, 2004Publication date: December 16, 2004Applicant: Arch Specialty Chemicals, Inc.Inventors: IIya Rushkin, Ahmad A. Naiini, Richard Hopla, Pamela J. Waterson, William D. Weber, David B. Powell
-
Publication number: 20040229160Abstract: A positive photosensitive resin composition comprising:Type: ApplicationFiled: March 4, 2004Publication date: November 18, 2004Applicant: ARCH SPECIALTY CHEMICALS, INC.Inventors: Ahmad A. Naiini, Pamela J. Waterson, William D. Weber, Ilya Rushkin, Richard Hopla, Jon Metivier
-
Publication number: 20040229166Abstract: A heat resistant negative working photosensitive composition that comprisesType: ApplicationFiled: March 8, 2004Publication date: November 18, 2004Applicant: ARCH SPECIALTY CHEMICALS, INC.Inventors: Ilya Rushkin, Ahmad A. Naiini, Richard Hopla, Pamela J. Waterson, William D. Weber
-
Publication number: 20040229167Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.Type: ApplicationFiled: March 4, 2004Publication date: November 18, 2004Applicant: ARCH SPECIALTY CHEMICALS, INC.Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu