Patents by Inventor William Desmond Boring

William Desmond Boring has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ARCHITECTURAL FLOORING UNDERLAYMENT
    Publication number: 20230085014
    Abstract: A fibrous structure having one or more vertically lapped layers having a first surface and a second surface and a facing layer secured to the first surface of the vertically lapped layer. The fibrous structure is adapted to be used in a flooring assembly. The fibrous structure may include a mesh and/or a backing layer on the second surface of a vertically lapped layer. The fibrous structure exhibits improved performance in below room testing and/or in-room testing as compared with traditional materials of the same thickness.
    Type: Application
    Filed: January 27, 2021
    Publication date: March 16, 2023
    Applicants: Zephyros, Inc., Pak-Lite, Inc.
    Inventors: Varun Mohan, Christophe Chaut, Kendall Bush, Greg Thompson, William Desmond Boring