Patents by Inventor William Determan

William Determan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8859882
    Abstract: A heat rejection system includes a plurality of panel subassemblies and a solid state heat pipe flex joint. Each panel subassembly includes a fin, a solid state heat pipe manifold, a first solid state heat pipe tube operatively connected to the solid state heat pipe manifold and secured to the fin, a second solid state heat pipe tube operatively connected to the solid state heat pipe manifold adjacent to the first solid state heat pipe and secured to the fin. The solid state heat pipe flex joint operably connects the solid state heat pipe manifolds of two of the plurality of panel subassemblies in a hermetically sealed configuration, and is configured to permit repositioning of the two panel subassemblies relative to each other.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: October 14, 2014
    Assignee: Aerojet Rocketdyne of DE, Inc.
    Inventors: Cheng-Yi Lu, James A. McClanahan, Joseph P. Carroll, William Determan, Patrick E. Frye, Charles Thomas Kudija, Rick L. Howerton, Kenneth John Metcalf, Andrew J. Zillmer
  • Patent number: 8783246
    Abstract: A solar receiver device includes a metal conduit and a glass container disposed around the metal conduit such that there is a space between the glass container and the conduit. A coating is disposed on the metal conduit and has a composition that includes at least one element from silicon, titanium, aluminum, barium, and samarium.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: July 22, 2014
    Assignee: Aerojet Rocketdyne of DE, Inc.
    Inventors: Cheng-Yi Lu, William Determan, David Grimmett, Gregory A. Johnson
  • Patent number: 8787516
    Abstract: An apparatus is provided and includes a reactor core, a boom and a shield assembly supportively interposed between the reactor core and the boom, a heat pipe disposed in thermal communication with the reactor core, a thermoelectric power converter operably coupled to the heat pipe, struts supportively coupled to the heat pipe at opposite ends of the power converter and hinge joints to rotatably couple the struts to the boom, at least one of the hinge joints being spring-loaded.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: July 22, 2014
    Assignee: Aerojet Rocketdyne of DE, Inc.
    Inventors: Cheng-Yi Lu, William Determan
  • Patent number: 8512667
    Abstract: A method of forming a nanocomposite thermoelectric material having microstructural stability at temperatures greater than 1,000° C. The method includes creating nanocrystalline powder by cryomilling. The method is particularly useful in forming SiGe alloy powder.
    Type: Grant
    Filed: November 15, 2010
    Date of Patent: August 20, 2013
    Assignee: Pratt & Whitney, Rocketdyne, Inc.
    Inventors: Sherwin Yang, Daniel Edward Matejczyk, William Determan
  • Patent number: 8286335
    Abstract: A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: October 16, 2012
    Assignee: Hamilton Sundstrand Space Systems International, Inc.
    Inventors: William Determan, Daniel Edward Matejczyk
  • Publication number: 20120121495
    Abstract: A method of forming a nanocomposite thermoelectric material having microstructural stability at temperatures greater than 1,000° C. The method includes creating nanocrystalline powder by cryomilling. The method is particularly useful in forming SiGe alloy powder.
    Type: Application
    Filed: November 15, 2010
    Publication date: May 17, 2012
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Sherwin Yang, Daniel Edward Matejczyk, William Determan
  • Patent number: 8128418
    Abstract: A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: March 6, 2012
    Assignee: Hamilton Sundstrand Space Systems International, Inc.
    Inventors: William Determan, Daniel Edward Matejczyk
  • Publication number: 20120042500
    Abstract: A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
    Type: Application
    Filed: July 14, 2011
    Publication date: February 23, 2012
    Applicant: HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC.
    Inventors: William Determan, Daniel Edward Matejczyk
  • Publication number: 20120045948
    Abstract: A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
    Type: Application
    Filed: August 17, 2010
    Publication date: February 23, 2012
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventors: William Determan, Daniel Edward Matejczyk
  • Publication number: 20110138811
    Abstract: A solar receiver device includes a metal conduit and a glass container disposed around the metal conduit such that there is a space between the glass container and the conduit. A coating is disposed on the metal conduit and has a composition that includes at least one element from silicon, titanium, aluminum, barium, and samarium.
    Type: Application
    Filed: December 14, 2009
    Publication date: June 16, 2011
    Inventors: Cheng-Yi Lu, William Determan, David Grimmett, Gregory A. Johnson
  • Publication number: 20100078061
    Abstract: A heat rejection system includes a plurality of panel subassemblies and a solid state heat pipe flex joint. Each panel subassembly includes a fin, a solid state heat pipe manifold, a first solid state heat pipe tube operatively connected to the solid state heat pipe manifold and secured to the fin, a second solid state heat pipe tube operatively connected to the solid state heat pipe manifold adjacent to the first solid state heat pipe and secured to the fin. The solid state heat pipe flex joint operably connects the solid state heat pipe manifolds of two of the plurality of panel subassemblies in a hermetically sealed configuration, and is configured to permit repositioning of the two panel subassemblies relative to each other.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Applicant: Hamilton Sundstrand Corporation
    Inventors: Cheng-Yi Lu, James A. McClanahan, Joseph P. Carroll, William Determan, Patrick E. Frye, Charles Thomas Kudija, Rick L. Howerton, Kenneth John Metcalf, Andrew J. Zillmer