Abstract: A vehicular entertainment module is disclosed. The vehicular entertainment module includes a video screen, speakers/headphones, an audio/video input device, and a satellite antenna and receiver. The audio/video input device processes media input by a user. The satellite antenna and receiver receives satellite audio signals and satellite video signals for decoding by an audio and video data decoder. The video screen and speakers/headphones provide video and audio output from the the audio/video input device or the received satellite audio signals and satellite video signals.

Abstract: The present invention provides a flexible multi-channel system comprising at least one receiver capable of providing simultaneous output of multiple channels, each requiring exchange of security information to identify and control its subscription level, from a single received signal source. Each receiver has a base circuit and a plurality of portable circuits adapted to detachably interface with the base circuit. The base circuit is defined within a base unit of the receiver, and each of portable circuits is defined within a portable device operably connectable to the base unit.

Abstract: A satellite-based digital audio radio (SDAR) receiver is configured to temporarily store data that may be transmitted to the SDAR receiver at a time inconvenient to the subscriber. A memory arrangement buffers data output by a channel decoder. The SDAR receiver can use the buffered data prior to using any currently transmitted data. The buffered data is associated with buffered timing information that lags behind the current timing information associated with the currently transmitted data. The buffered data is available for use only once before a decryption subsystem receives the current timing information. If the subscriber uses the currently transmitted data, the decryption subsystem receives the current timing information. The decryption subsystem decrypts only data that is associated with timing information that is no earlier than the latest timing information received by the decryption subsystem.

Abstract: The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms.

Abstract: The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms.

Abstract: The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms.

Abstract: N+ type semiconductor substrates containing oxygen are thermally treated to enhance internal gettering capabilities by heating at 1050.degree. to 1200.degree. C., then at 500.degree. to 900.degree. C. and finally at 950.degree. to 1250.degree. C.