Abstract: An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.

Abstract: An improved rack-mounted server comprises, in one embodiment, a slidable electronics tray having a top cover secured to the rack, to facilitate access to the tray when it is withdrawn from the rack. The tray also includes a camming mechanism to facilitate insertion of the tray into and its extraction from cable connectors or plugs affixed to the rack. The tray includes, in one embodiment, a movement detection mechanism to power it up or down when tray insertion or removal, respectively, is initiated. In addition, the rack includes an improved cable management system that can accommodate different cables and cable plugs. As a tray is inserted into or removed from the rack, corresponding connectors on the tray are electrically coupled to or uncoupled from cable plugs affixed to the rack, eliminating any need to remove cables from the tray or reinstall them.

Abstract: An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: An improved rack-mounted server comprises, in one embodiment, a slidable electronics tray having a top cover secured to the rack, to facilitate access to the tray when it is withdrawn from the rack. The tray also includes a camming mechanism to facilitate insertion of the tray into and its extraction from cable connectors or plugs affixed to the rack. The tray includes, in one embodiment, a movement detection mechanism to power it up or down when tray insertion or removal, respectively, is initiated. In addition, the rack includes an improved cable management system that can accommodate different cables and cable plugs. As a tray is inserted into or removed from the rack, corresponding connectors on the tray are electrically coupled to or uncoupled from cable plugs affixed to the rack, eliminating any need to remove cables from the tray or reinstall them.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: An improved rack-mounted server comprises, in one embodiment, a slidable electronics tray having a top cover secured to the rack, to facilitate access to the tray when it is withdrawn from the rack. The tray also includes a camming mechanism to facilitate insertion of the tray into and its extraction from cable connectors or plugs affixed to the rack. The tray includes, in one embodiment, a movement detection mechanism to power it up or down when tray insertion or removal, respectively, is initiated. In addition, the rack includes an improved cable management system that can accommodate different cables and cable plugs. As a tray is inserted into or removed from the rack, corresponding connectors on the tray are electrically coupled to or uncoupled from cable plugs affixed to the rack, eliminating any need to remove cables from the tray or reinstall them.

Abstract: An improved rack-mounted server comprises, in one embodiment, a slidable electronics tray having a top cover secured to the rack, to facilitate access to the tray when it is withdrawn from the rack. The tray also includes a camming mechanism to facilitate insertion of the tray into and its extraction from cable connectors or plugs affixed to the rack. The tray includes, in one embodiment, a movement detection mechanism to power it up or down when tray insertion or removal, respectively, is initiated. In addition, the rack includes an improved cable management system that can acconmmodate different cables and cable plugs. As a tray is inserted into or removed from the rack, corresponding connectors on the tray are electrically coupled to or uncoupled from cable plugs affixed to the rack, eliminating any need to remove cables from the tray or reinstall them.

Abstract: An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.