Patents by Inventor William E. Boyd

William E. Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957878
    Abstract: The invention provides methods and apparatus for injecting a medicine, especially a highly viscous medicine. Conventional methods and apparatus for injecting viscous medicines suffers suffer from a variety of problems such as excessive force during the initial needle insertion and initial injection. In an inventive method, during the initial phase of the injection, energy is stored in a torsion spring that is subsequently released during a later stage of the injection. The present invention also provides for an improved autoinjector; especially via the use of a combination compression and torsion spring that powers the injection through controlling force applied to a plunger via a screw flange or nut having pins that ride in a prescribed path down the length of the autoinjector.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: April 16, 2024
    Assignee: Battelle Memorial Institute
    Inventors: William G. Atterbury, Douglas E. Boyd
  • Patent number: 9928118
    Abstract: Monitoring resource allocation requests to computer resources shared between a plurality of computers includes detecting an allocation request by an application for a first set of the plurality of computer resources and assigning the application to a group, wherein each member of the group comprises a respective application having an associated allocation request for an associated set of the plurality of computer resources. Determining that the first set of the plurality of computer resources cannot be allocated by the application, and determining that the first application generates a function call instructing other members of the group, if any, to request allocation of their associated set of the plurality of computer resources results in incrementing a counter value corresponding to the group. A message is sent when the counter value exceeds a predetermined threshold.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: March 27, 2018
    Assignee: CA, Inc.
    Inventors: James E. Anderson, David R. Jones, William E. Boyd, Jr., David E. Rhodes, II, Robert L. Carpenter, Jason A. Tucker
  • Patent number: 9306894
    Abstract: Managing computer resource allocation includes detecting, by one computer amongst a plurality of computers, generation of an allocation request, wherein the allocation request requests exclusive access, by the one computer, to a computer resource shared between the plurality of computers; determining a period of time that has elapsed since detection of the generation of the allocation request; determining that a delay has occurred when the period of time has exceeded a predetermined threshold; and then, transmitting, by the one computer, a delay message based on the delay to each of the plurality of computers.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: April 5, 2016
    Assignee: CA, Inc.
    Inventors: James E. Anderson, William E. Boyd, Jr., Robert L. Carpenter, David R Jones, David E. Rhodes, II, Jason A. Tucker
  • Patent number: 8299594
    Abstract: A multilayer module comprised of stacked IC package layers is disclosed. A plurality of layers preferably having ball grid array I/O are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronics signals to and from the layers in the module and for connection to an external circuit.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 30, 2012
    Assignee: Aprolase Development Co., LLC
    Inventors: Daniel Michaels, William E. Boyd
  • Publication number: 20100140777
    Abstract: A multilayer module comprised of stacked IC package layers is disclosed. A plurality of layers preferably having ball grid array I/O are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronics signals to and from the layers in the module and for connection to an external circuit.
    Type: Application
    Filed: January 29, 2010
    Publication date: June 10, 2010
    Inventors: Daniel Michaels, William E. Boyd
  • Patent number: 7709943
    Abstract: A multilayer module comprised of stacked IC package layers is disclosed. A plurality of layers preferably having ball grid array I/O are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronics signals to and from the layers in the module and for connection to an external circuit.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: May 4, 2010
    Inventors: Daniel Michaels, William E. Boyd
  • Patent number: 7511369
    Abstract: A three dimensional electronic module is disclosed. Conventional TSOP packages are modified to expose internal lead frame interconnects, thinned and stacked on a reroute substrate. The reroute substrate comprises conductive circuitry for the input and output of electrical signals from one or more TSOPs in the stack to a ball grid array pattern. The exposed internal lead frames are interconnected and routed on one or more side buses on the module to the reroute substrate for connection to external electronic circuitry. Alternatively, internal wire bonds or ball bonds may be exposed in the TSOP packages and routed to the side bus for interconnection to create a BGA scale module. One or more neolayers may also be bonded to a reroute substrate to create a BGA scale module.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: March 31, 2009
    Assignee: Irvine Sensors Corp.
    Inventors: Gann Keith, William E. Boyd
  • Patent number: 6064352
    Abstract: The invention relates to high stiffness parabolic structures utilizing integral reinforced grids. The parabolic structures implement the use of isogrid structures which incorporate unique and efficient orthotropic patterns for efficient stiffness and structural stability.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: May 16, 2000
    Assignees: TRW Inc., Composite Optics Inc.
    Inventors: Edward M. Silverman, William E. Boyd, Jr., Marvin D. Rhodes, Jack E. Dyer
  • Patent number: 5511674
    Abstract: An accessory tray for use in supporting surgical pads, the accessory tray adapted for connection to a surgical stand wherein the accessory tray comprises a support section having an outer surface for receiving the surgical pads, a connection section extending from the support section, the connection section including an attachment means for removably connecting the support section to the surgical stand wherein the support section is disposed at an acute angle in relation to the surgical stand.
    Type: Grant
    Filed: December 14, 1993
    Date of Patent: April 30, 1996
    Inventors: William E. Boyd, Lynn D. Boyd
  • Patent number: D454186
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: March 5, 2002
    Assignee: International Comfort Products Corporation
    Inventors: Cosimo Caronna, William E. Boyd, Danny R. Burdette, Thompson J. Matambo
  • Patent number: D434480
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: November 28, 2000
    Assignee: International Comfort Products Corporation (USA)
    Inventors: Cosimo Caronna, William E. Boyd, Danny R. Burdette, Thompson J. Matambo