Patents by Inventor William E. BREINER

William E. BREINER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection
    Publication number: 20170358552
    Abstract: A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.
    Type: Application
    Filed: August 28, 2017
    Publication date: December 14, 2017
    Applicant: International Business Machines Corporation
    Inventors: William E. BREINER, BING DANG, MARIO J. INTERRANTE, JOHN U. KNICKERBOCKER, SON K. TRAN