Patents by Inventor William E. Burdick

William E. Burdick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7982570
    Abstract: An inductor includes an electrical conductor wound in a magnetic flux concentrating pattern, the electrical conductor comprises a plurality of carbon nanotubes that are substantially aligned with an axis along a center of the electrical conductor.
    Type: Grant
    Filed: November 7, 2006
    Date of Patent: July 19, 2011
    Assignee: General Electric Company
    Inventors: William E. Burdick, Jr., Ji-Ung Lee, Michael A. de Rooij
  • Patent number: 7735412
    Abstract: A commercial multiple barrel beer brewing apparatus includes a brew kettle at a first location; a hopped wort holding vessel; a chiller for chilling the hopped wort stored in the holding vessel to a temperature range of approximately 29° F. to 40° F.; a transportation vessel on a vehicle to transport chilled hopped wort to a brew pub; a first conduit between the chilled hopped wort holding vessel and the transportation vessel; a fermentation vessel located a brew pub; and a second conduit between the transportation vessel and the fermentation vessel.
    Type: Grant
    Filed: May 7, 2007
    Date of Patent: June 15, 2010
    Assignee: Granite City Food and Brewery, Ltd.
    Inventor: William E. Burdick
  • Patent number: 7564125
    Abstract: A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections positioned on the back side of the substrate, the input/output connections electrically coupled to the transducers, at least one electronic device, and an interposer positioned between the substrate and the electronic device, the interposer including a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: July 21, 2009
    Assignee: General Electric Company
    Inventors: William E. Burdick, Jr., James W. Rose, Donna M. Sherman, James E. Sabatini, George Edward Possin
  • Patent number: 7403011
    Abstract: An improved magnetic resonance (MR) imaging system (10) is provided. A plurality of receiver coils (12) may be configured to supply respective coil output signals based on a plurality of magnetic resonance response signals sensed by the receiver coils. Each receiver coil defines an enclosure constituting a Faraday cage. At least one circuit device (22) is disposed in the enclosure (24) to condition the coil output signal. This enclosure enables the circuit device (22) to be shielded from electromagnetic interference.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: July 22, 2008
    Assignee: General Electric Company
    Inventors: William E. Burdick, Jr., Richard Louis Frey, James Enrico Sabatini
  • Publication number: 20080136414
    Abstract: An integrated balun-low noise amplifier (LNA) system is included in a magnetic resonance imaging system. The integrated balun-LNA system conditions electromagnetic signals received from at least one RF receiver coil. The integrated balun-LNA system is configured to be enclosed in a balun housing. The size of the integrated balun-LNA system minimizes component area and volume thereof on or near the RF receiver coil and thus, minimizes interference with the magnetic flux field.
    Type: Application
    Filed: December 11, 2006
    Publication date: June 12, 2008
    Inventors: Michael A. de Rooij, Randy Otto John Giaquinto, William E. Burdick, Eladio Clemente Delgado
  • Publication number: 20080122439
    Abstract: An inductor includes an electrical conductor wound in a magnetic flux concentrating pattern, the electrical conductor comprises a plurality of carbon nanotubes that are substantially aligned with an axis along a center of the electrical conductor.
    Type: Application
    Filed: November 7, 2006
    Publication date: May 29, 2008
    Inventors: William E. Burdick, Ji-Ung Lee, Michael A. de Rooij
  • Patent number: 7378851
    Abstract: An integrated balun-low noise amplifier (LNA) system is included in a magnetic resonance imaging system. The integrated balun-LNA system conditions electromagnetic signals received from at least one RF receiver coil. The integrated balun-LNA system is configured to be enclosed in a balun housing. The size of the integrated balun-LNA system minimizes component area and volume thereof on or near the RF receiver coil and thus, minimizes interference with the magnetic flux field.
    Type: Grant
    Filed: December 11, 2006
    Date of Patent: May 27, 2008
    Assignee: General Electric Company
    Inventors: Michael A. de Rooij, Randy Otto John Giaquinto, William E. Burdick, Jr., Eladio Clemente Delgado
  • Patent number: 7214402
    Abstract: The present invention calls for the establishment of a centralized facility for the production of unfermented, undiluted, and unprocessed hopped wort using a single source of water. The hopped wort is then cooled and transported to a plurality of remote fermentation sites where the hopped wort will be fermented into beer by the addition of yeast. The fermentation sites are preferably located within a restaurant to provide the diners with the aesthetic enjoyment of consuming beers fermented on the premises and to provide a consistent quality from one restaurant location to the next where such beers are produced.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: May 8, 2007
    Assignee: Granite City Food & Brewery, Ltd.
    Inventor: William E. Burdick
  • Patent number: 6819001
    Abstract: An interposer, interposer package and device assembly employing the same are provided. The interposer has a substrate formed of a semiconductor material, with first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof. The second input/output contacts are electrically connected to the first input/output contacts. The first input/output contacts disposed over the first main surface of the interposer substrate are for attachment to input/output pads of a device to which the interposer is to be attached. The second input/output contacts disposed over the second main surface of the interposer substrate facilitate electrical coupling to a component to which the interposer is also to be attached.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: November 16, 2004
    Assignee: General Electric Company
    Inventors: William E. Burdick, Jr., James W. Rose
  • Publication number: 20040178484
    Abstract: An interposer, interposer package and device assembly employing the same are provided. The interposer has a substrate formed of a semiconductor material, with first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof. The second input/output contacts are electrically connected to the first input/output contacts. The first input/output contacts disposed over the first main surface of the interposer substrate are for attachment to input/output pads of a device to which the interposer is to be attached. The second input/output contacts disposed over the second main surface of the interposer substrate facilitate electrical coupling to a component to which the interposer is also to be attached.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 16, 2004
    Applicant: General Electric Company
    Inventors: William E. Burdick, James W. Rose
  • Publication number: 20040109299
    Abstract: A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections positioned on the back side of the substrate, the input/output connections electrically coupled to the transducers, at least one electronic device, and an interposer positioned between the substrate and the electronic device, the interposer including a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.
    Type: Application
    Filed: December 6, 2002
    Publication date: June 10, 2004
    Inventors: William E. Burdick, James W. Rose, Donna M. Sherman, James E. Sabatini, George Edward Possin
  • Publication number: 20030224088
    Abstract: The present invention calls for the establishment of a centralized facility for the production of unfermented, undiluted, and unprocessed hopped wort using a single source of water. The hopped wort is then cooled and transported to a plurality of remote fermentation sites where the hopped wort will be fermented into beer by the addition of yeast. The fermentation sites are preferably located within a restaurant to provide the diners with the aesthetic enjoyment of consuming beers fermented on the premises and to provide a consistent quality from one restaurant location to the next where such beers are produced.
    Type: Application
    Filed: April 9, 2003
    Publication date: December 4, 2003
    Inventor: William E. Burdick
  • Publication number: 20020041916
    Abstract: The present invention calls for the establishment of a centralized facility for the production of unfermented, undiluted, and unprocessed hopped wort using a single source of water. The hopped wort is then cooled and transported to a plurality of remote fermentation sites where the hopped wort will be fermented into beer by the addition of yeast. The fermentation sites are preferably located within a restaurant to provide the diners with the aesthetic enjoyment of consuming beers fermented on the premises and to provide a consistent quality from one restaurant location to the next where such beers are produced.
    Type: Application
    Filed: February 5, 2001
    Publication date: April 11, 2002
    Inventor: William E. Burdick
  • Patent number: 5255431
    Abstract: Pin-mounted components, such as DIP-packaged devices, multi-pin toroids and memory cubes are integrated into high density interconnect (HDI) structures by external attachment. Frozen spheres of conductive epoxy are placed, using automated pick-and-place equipment, into laser-drilled well-like via holes in an HDI module and then thawed under temperature and vacuum, prior to component pin insertion. Precision dispensing and uniform dispersion of adhesive results.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: October 26, 1993
    Assignee: General Electric Company
    Inventor: William E. Burdick