Abstract: An inductor includes an electrical conductor wound in a magnetic flux concentrating pattern, the electrical conductor comprises a plurality of carbon nanotubes that are substantially aligned with an axis along a center of the electrical conductor.

Abstract: A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections positioned on the back side of the substrate, the input/output connections electrically coupled to the transducers, at least one electronic device, and an interposer positioned between the substrate and the electronic device, the interposer including a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.

Abstract: An improved magnetic resonance (MR) imaging system (10) is provided. A plurality of receiver coils (12) may be configured to supply respective coil output signals based on a plurality of magnetic resonance response signals sensed by the receiver coils. Each receiver coil defines an enclosure constituting a Faraday cage. At least one circuit device (22) is disposed in the enclosure (24) to condition the coil output signal. This enclosure enables the circuit device (22) to be shielded from electromagnetic interference.

Abstract: An integrated balun-low noise amplifier (LNA) system is included in a magnetic resonance imaging system. The integrated balun-LNA system conditions electromagnetic signals received from at least one RF receiver coil. The integrated balun-LNA system is configured to be enclosed in a balun housing. The size of the integrated balun-LNA system minimizes component area and volume thereof on or near the RF receiver coil and thus, minimizes interference with the magnetic flux field.

Abstract: An interposer, interposer package and device assembly employing the same are provided. The interposer has a substrate formed of a semiconductor material, with first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof. The second input/output contacts are electrically connected to the first input/output contacts. The first input/output contacts disposed over the first main surface of the interposer substrate are for attachment to input/output pads of a device to which the interposer is to be attached. The second input/output contacts disposed over the second main surface of the interposer substrate facilitate electrical coupling to a component to which the interposer is also to be attached.