Abstract: An EMI attenuation device comprising at least two substrates such that the spacing between these substrates is selected to maximize shielding performance at a particular frequency. The device further comprises additional substrates arranged at predetermined distances from the first two substrates to optimize shielding performance. A method also is provided for a multistep, attenuation of impinging EMI, wherein the method also enables see-through and/or hear-through monitoring. Salient features of the method include relatively positioning a plurality of electrically conductive substrates, each of a particular topology, so as to maximize attenuation of the EMI at particular frequencies.

Abstract: An EMI attenuation device comprising at least two substrates such that the spacing between these substrates is selected to maximize shielding performance at a particular frequency. The device further comprises additional substrates arranged at predetermined distances from the first two substrates to optimize shielding performance. A method also is provided for a multi-step, attenuation of impinging EMI, wherein the method also enables see-through and/or hear-through monitoring. Salient features of the method include relatively positioning a plurality of electrically conductive substrates, each of a particular topology, so as to maximize attenuation of the EMI at particular frequencies.

Abstract: An EMI attenuation device including at least two substrates such that the spacing between these substrates is selected to maximize shielding performance at a particular frequency. The device further includes additional substrates arranged at predetermined distances from the first two substrates to optimize shielding performance. A method also is provided for a multi-step, attenuation of impinging EMI, wherein the method also enables see-through and/or hear-through monitoring. Salient features of the method include relatively positioning a plurality of electrically conductive substrates, each of a particular topology, so as to maximize attenuation of the EMI at particular frequencies.

Abstract: A shielding vent for an electromagnetic interference shielded enclosure having an electrically conducting wall shield includes a mounting plate or flange through which extends a vent pipe with an internal septum plate or divider extending axially along at least a portion of the inner length of the vent pipe. The mounting flange is secured to a wall of the shielded enclosure over an opening in the wall and to the wall shield to insure that the integrity of the shielding for the enclosure is maintained. With the mounting flange so mounted on the wall of the enclosure, the vent pipe extends through the opening in the wall of the enclosure and provides fluid communication between an internal region of the enclosure and a region external of the enclosure. The septum plate has a cross section in the shape of a cross so that at least a portion of the length of the cylindrically shaped vent pipe is subdivided into four parallel, axially extending equal fluid flow sections.

Abstract: A method of forming EMI shielded enclosures, an EMI shielded enclosure and EMI shield are provided. A sealer composition is applied onto a surface and is allowed to substantially dry cure into a uniform, seamless layer. An adhesive composition is applied to the dried sealer composition. Then, an electrically-conductive material, such as metallic sheet, such as copper sheeting, is attached to the dried sealer composition by the adhesive composition. Alternatively, a bonded sheet of dielectric material is applied to the adhesive composition. Then the metallic sheet is attached to the bonded sheet of dielectric material by an adhesive composition second layer.