Abstract: An EMI attenuation device comprising at least two substrates such that the spacing between these substrates is selected to maximize shielding performance at a particular frequency. The device further comprises additional substrates arranged at predetermined distances from the first two substrates to optimize shielding performance. A method also is provided for a multistep, attenuation of impinging EMI, wherein the method also enables see-through and/or hear-through monitoring. Salient features of the method include relatively positioning a plurality of electrically conductive substrates, each of a particular topology, so as to maximize attenuation of the EMI at particular frequencies.

Abstract: An EMI attenuation device including at least two substrates such that the spacing between these substrates is selected to maximize shielding performance at a particular frequency. The device further includes additional substrates arranged at predetermined distances from the first two substrates to optimize shielding performance. A method also is provided for a multi-step, attenuation of impinging EMI, wherein the method also enables see-through and/or hear-through monitoring. Salient features of the method include relatively positioning a plurality of electrically conductive substrates, each of a particular topology, so as to maximize attenuation of the EMI at particular frequencies.