Patents by Inventor William E. Davern

William E. Davern has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compact, thermally efficient focal plane array and testing and repair thereof
    Patent number: 5157255
    Abstract: In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.
    Type: Grant
    Filed: November 21, 1991
    Date of Patent: October 20, 1992
    Assignee: General Electric Company
    Inventors: William P. Kornrumpf, Walter M. Marcinkiewicz, William E. Davern, Herbert C. Ziegler, Jonathan R. Miles
  • Compact, thermally efficient focal plane array and testing and repair thereof
    Patent number: 5146303
    Abstract: In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.
    Type: Grant
    Filed: April 5, 1990
    Date of Patent: September 8, 1992
    Assignee: General Electric Company
    Inventors: William P. Kornrumpf, Walter M. Marcinkiewicz, William E. Davern, Herbert C. Zieger, Jonathan R. Miles