Abstract: A device package and method of fabrication where the device is bonded to the package housing using a bonding medium. The medium includes a solid compliant material, preferably with pressure sensitive adhesive layers formed on the major surfaces. The bonding medium results in reduced stresses on the device, and is especially suitable for photo-elastic devices such as lithium niobate optical devices.

Abstract: A heater system for heating an erbium-doped fiber amplifier (EDFA) of a fiber optic communication system operable in an environment. The heater system includes a pump laser for providing optical power to an erbium fiber in the EDFA. The pump laser is cooled by a thermoelectric cooler (TEC) when a predetermined maximum temperature is reached to maintain the temperature of the laser below the maximum temperature value. The temperature of the laser is sensed by a temperature sensor and is conveyed to a control circuit for generating a control signal. A heater unit is thermally connected to the erbium fiber and is controlled by the control signal in the event that the sensed temperature falls below a predetermined minimum value to maintain the temperature of the fiber above the minimum temperature value. A switch is connected between the control circuit, the TEC and the heater to automatically direct current to either the heater or the TEC depending on the sensed temperature.