Patents by Inventor William E. Everitt

William E. Everitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8256340
    Abstract: The illustrative embodiment of the present invention is a launch system that includes a missile canister cover that, in use, is attached to a missile canister. The cover is capable of being blown off of the canister before there is any contact between the nose of the missile and the cover and is further capable of withstanding a higher ambient pressure than internal canister pressure. These capabilities are achieved based on an attention to material mechanics and the prevailing geometry of the system.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: September 4, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: Brian E. Bohs, William E. Everitt
  • Patent number: 5958325
    Abstract: Large composite structures are produced using a vacuum assisted resin transfer molding process incorporating a resin distribution network. The structure includes cores each having a main feeder groove or channel therein. A resin distribution network is provided adjacent the core surface in fluid communication with the feeder groove. In a first embodiment, the resin distribution network comprises a plurality of microgrooves formed in each core surface. In a second embodiment, the resin distribution network comprises a separate distribution medium surrounding each core. Each core and associated resin distribution network is covered with a fiber material. The dry lay-up is placed against a mold and encapsulated in a vacuum bag. Uncured resin is fed under vacuum directly into the main feeder groove in each core via a fitting through the bag. The resin flows from the main feeder groove through the resin distribution network and outwardly into the fiber material and is allowed to cure.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: September 28, 1999
    Assignee: TPI Technology, Inc.
    Inventors: William H. Seemann, III, George C. Tunis, III, Andrew P. Perrella, Rikard K. Haraldsson, William E. Everitt, Everett A. Pearson
  • Patent number: 5721034
    Abstract: Large composite structures are produced using a vacuum assisted resin transfer molding process incorporating a resin distribution network. The structure includes cores each having a main feeder groove or channel therein. A resin distribution network is provided adjacent the core surface in fluid communication with the feeder groove. In a first embodiment, the resin distribution network comprises a plurality of microgrooves formed in each core surface. In a second embodiment, the resin distribution network comprises a separate distribution medium surrounding each core. Each core and associated resin distribution network is covered with a fiber material. The dry lay-up is placed against a mold and encapsulated in a vacuum bag. Uncured resin is fed under vacuum directly into the main feeder groove in each core via a fitting through the bag. The resin flows from the main feeder groove through the resin distribution network and outwardly into the fiber material and is allowed to cure.
    Type: Grant
    Filed: August 2, 1996
    Date of Patent: February 24, 1998
    Assignee: Scrimp Systems, L.L.C.
    Inventors: William H. Seemann, III, George C. Tunis, III, Andrew P. Perrella, Rikard K. Haraldsson, William E. Everitt, Everett A. Pearson