Abstract: A method is provided for suppressing a transient signal (VTR) using a single semiconductor die (130). The method comprises the step of loading the transient signal with first and second junctions (110, 112) formed adjacent to a first doped region (140) of the semiconductor die. The first junction breaks down to generate a current while the second junction forward biases to route the current across an undepleted portion (161) of the first doped region and through the second junction.

Abstract: An improved monolithic, temperature compensated voltage- reference diode is realized by creating a tub of epitaxial semiconductor material in a substrate of opposite conductivity type and creating a voltage reference junction at a surface of the tub. The junction between the tub and the substrate forms the forward-biased, temperature compensating junction of the device. The dopant concentration is varied during growth of the epitaxial material to provide a relatively low resistivity at the voltage-reference junction and a higher resistivity at the temperature compensating junction. The method described offers significant improvement over prior methods of manufacturing such devices in the area of cost and reliability.

Abstract: An improved monolithic, temperature compensated voltage-reference diode is realized by creating a tub of epitaxial semiconductor material in a substrate of opposite conductivity type and creating a voltage reference junction at a surface of the tub. The junction between the tub and the substrate forms the forward-biased, temperature compensating junction of the device. The dopant concentration is varied during growth of the epitaxial material to provide a relatively low resistivity at the voltage-reference junction and a higher resistivity at the temperature compensating junction. The method described offers significant improvement over prior methods of manufacturing such devices in the area of cost and reliability.

Abstract: Zener diodes and other semiconductor junctions having very low noise characteristics and improved yield may be obtained by first ion implanting a suitable impurity into a substrate wafer, and then forming the p-n junction using a very rapid thermal activation and annealing process. For p-n junctions formed with boron (.sup.11 B) implanted into n-type silicon to a peak concentration exceeding 10.sup.20 atoms/cm.sup.3, the rapid activation process comprises heating from about room temperature to about 1150.degree. C. in 12-30 seconds, and then cooling back below 1000 degrees C. in less than 5 seconds. Noise voltages measured on devices formed using the invented process were typically much lower and more narrowly grouped than on devices of the prior art. Dynamic impedance was also slightly reduced.