Patents by Inventor William E. McMullen

William E. McMullen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer wiring board and multilayer wiring package
    Patent number: 6372999
    Abstract: A multilayer wiring board 10 comprises a substrate having a plurality of layers of reinforced resin material 12,18,19,26,18′,19′,26′, a patterned conductive layer 28,28′ provided on at least one major surface of the substrate, a plurality of via holes 30,32,34,36 provided at least partly through the substrate, and a plurality of signal carrying wires 20,20′. The signal carrying wires 20,20′ are provided between at least two of the layers of reinforced resin material 12,18,19,26,18′,19′,26′. The signal carrying wires 20,20′ can be embedded in a resin layer 21,21′, and the resin layer 21,21′ sandwiched between a pair 18,19,18′,19 of the layers of reinforced resin material. The reinforced resin material 12,18,19,26,18′,19 is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core 22,24,22′,24′, e.g.
    Type: Grant
    Filed: April 20, 1999
    Date of Patent: April 16, 2002
    Assignee: TRW Inc.
    Inventors: William D. Bjorndahl, M. David Saferstein, Alexander Krayner, Cindy S. Fietze, Kenneth C. Selk, Rene R. Martinez, William E. McMullen