Abstract: A multi-chip module or other electronic semiconductor component (1) contains a multi-layer substrate (9) whose bottom surface, the bottom of the bottom layer (15) of that substrate, serves as the bonding surface for bonding the multi-chip module or component to a printed wiring board (8) using a thermally sensitive adhesive, such as a thermally sensitive adhesive or solder. The bottom layer (15) of that multi-layer substrate integrally includes a plurality of electrical heaters (16-28), arranged side by side. When energized with appropriate current, the heater generates sufficient heat to weaken the adhesive bond, allowing the MCM to be pulled away from the printed wiring board and removed, without weakening the bonding of the multiple layers of the laminate substrate or weakening the MCM component's bond to that substrate.