Abstract: Systems and techniques for depositing organic material on a substrate are provided, in which one or more shield gas flows prevents contamination of the substrate by the chamber ambient. Thus, multiple layers of the same or different materials may be deposited in a single deposition chamber, without the need for movement between different deposition chambers, and with reduced chance of cross-contamination between layers.

Abstract: Embodiments of the disclosed subject matter provide a laser source configured to output a laser beam, a beam transfer cavity to receive the outputted laser beam on a first side of the apparatus and output the laser beam on a second side of the apparatus, wherein the first side is opposite the second side, and a plume removal device having an exhaust aperture on the second side of the apparatus facing a heat affected zone (HAZ). A bottom surface of the plume removal device may be facing the substrate, where organic matter is disposed on the substrate, and the HAZ may be aligned with the surface of the substrate having the organic matter to be ablated by the laser beam.

Abstract: Embodiments of the disclosed subject matter provide a device having a substrate, and a plurality of unit areas of an organic light emitting diode (OLED) display disposed on the substrate. The unit areas may be repeating, area-filling subdivisions on the substrate that each have an anode and a cathode. The organic film may be disposed over portions of the device other than the unit areas. The device may include at least one pixel having a plurality of sub-pixels disposed within each of the plurality of unit areas. The cathode of at least one pixel of each of the plurality of unit areas may be a common cathode.

Abstract: Embodiments of the disclosed subject matter provide systems and methods of depositing a film on a selective area of a substrate. A first jet of a first material may be ejected from a first nozzle assembly of a jet head having a plurality of nozzle assemblies to form a first portion of a film deposition on the substrate. A second jet of a second material may be ejected from a second nozzle assembly of the plurality of nozzle assemblies, the second nozzle assembly being aligned with the first nozzle assembly parallel to a direction of motion between the plurality of nozzle assemblies and the substrate, and the second material being different than the first material. The second material may react with the first portion of the film deposition to form a composite film deposition on the substrate when using reactive gas precursors.

Abstract: Methods and OLED devices are provided in which organic emissive materials are deposited over a substrate via OVJP print heads in a continuous line extending from one edge of the active display portion of a substrate to another. The print heads are arranged such that the sidewalls of the OVJP jet are disposed over non-emissive insulating portions of the display panel, thereby allowing for improved pixel density and resolution in comparison to conventional OVJP and similar techniques.

Abstract: A novel thin film encapsulated OLED panel architecture and a method for making the panels with improved shelf life is disclosed. The OLED panel consists of a plurality of OLED pixels; each OLED pixel is individually hermetically sealed and isolated from its neighboring pixels. The organic stack of the OLED pixel is contained within its own hermetically sealed structure, achieved by making the structure on a barrier coated substrate and using a first barrier material as the grid and a second barrier for encapsulating the entire OLED pixel. The first barrier material provides the edge seal while the second barrier disposed over the pixel provides protection from top down moisture diffusion. By isolating and hermetically sealing individual pixels; any damage such as moisture and oxygen ingress due to defects or particles, delamination, cracking etc. can be effectively contained within the pixel thereby protecting other pixels in the panel.

Abstract: A deposition nozzle is provided that includes offset deposition apertures disposed between exhaust apertures on either side of the deposition apertures. The provided nozzle arrangements allow for deposition of material with a deposition profile suitable for use in devices such as OLEDs.

Abstract: Systems and methods for depositing materials on a substrate via OVJP are provided. A float table and grippers are used to move and position the substrate relative to one or more OVJP print bars to reduce the chance of damaging or compromising the substrate or prior depositions.

Abstract: Designs and arrangements for sublimation cells are provided, which enriches an inert carrier gas with organic vapor such that the partial pressure of the organic vapor is highly stable in time. Stability is achieved by controlling the local rates of evaporation along the solid-gas interface through one or more crucibles, thereby reducing the effects of greater headspace and lowering interfacial area as the source depletes. Local evaporation rates also can be controlled using either temperature distribution or convective flow fields.

Abstract: Systems and techniques for depositing organic material on a substrate are provided, in which one or more shield gas flows prevents contamination of the substrate by the chamber ambient. Thus, multiple layers of the same or different materials may be deposited in a single deposition chamber, without the need for movement between different deposition chambers, and with reduced chance of cross-contamination between layers.

Abstract: Designs and arrangements for sublimation cells are provided, which enriches an inert carrier gas with organic vapor such that the partial pressure of the organic vapor is highly stable in time. Stability is achieved by controlling the local rates of evaporation along the solid-gas interface through one or more crucibles, thereby reducing the effects of greater headspace and lowering interfacial area as the source depletes. Local evaporation rates also can be controlled using either temperature distribution or convective flow fields.

Abstract: Devices suitable for use in OVJP and similar deposition techniques are provided that include multiple delivery apertures that are uncoupled from one another, allowing for more plateau-like deposition profiles. Fabrication techniques for such devices are also provided in which multiple wafers are etched and laminated to one another to form a monolithic depositor block.

Abstract: Systems and methods for depositing materials on a substrate via OVJP are provided. A float table and grippers are used to move and position the substrate relative to one or more OVJP print bars to reduce the chance of damaging or compromising the substrate or prior depositions.

Abstract: Methods and OLED devices are provided in which organic emissive materials are deposited over a substrate via OVJP print heads in a continuous line extending from one edge of the active display portion of a substrate to another. The print heads are arranged such that the sidewalls of the OVJP jet are disposed over non-emissive insulating portions of the display panel, thereby allowing for improved pixel density and resolution in comparison to conventional OVJP and similar techniques.

Abstract: Methods, systems, and devices are provided for organic vapor jet deposition (OVJP), which require significantly fewer print heads than conventional OVJP deposition systems. The disclosed OVJP systems include half the number of OVJP print heads than a conventional system, or less, and provide for relative movement of the substrate and print heads to allow for rapid and comprehensive material deposition over the full surface of the substrate.

Abstract: Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.

Abstract: Embodiments of the disclosed subject matter provide a device having a print head that includes a micronozzle array of depositors to deposit a material on a substrate. A reflective optical device may reflect a signal output by at least one optical sensor, and to reflect the signal from a surface of the substrate to the optical sensor. A processor may determine a distance between the optical sensor and the target surface of the substrate. The device may include one or more actuators coupled to the at least one print head to move the print head relative to an internal reference frame and adjust a position of the print head to the substrate. The sensor may be fixedly coupled with a mount to the internal reference frame. The print head may be configured to move independently of the optical sensor in at least one axis of linear or rotational motion.

Abstract: Methods and devices for controlling pressures in microenvironments between a deposition apparatus and a substrate are provided. Each microenvironment is associated with an aperture of the deposition apparatus which can allow for control of the microenvironment.

Abstract: Embodiments of the disclosed subject matter provide an apparatus having a device with a micronozzle array disposed on a micro-fabricated fluidic die. The device may include a first gas distribution plate and a second opposing plate, where the micro-fabricated fluidic die is disposed between the first gas distribution plate and the second opposing plate, wherein the first gas distribution plate is irreversibly joined to the micronozzle array with a seal that is gas-tight, and where the first gas distribution plate includes a plurality of sealed flow paths. A manifold may be reversibly joined to the first gas distribution plate, where the micro-fabricated fluidic die and the first gas distribution plate and the second opposing plate are disposed between the manifold. A thermally conductive plate may have at least one window that provides a clearance fit for the device across a range of motion relative to the thermally conductive plate.

Abstract: A hybrid permeation barrier having two complementary layers is disclosed. The barrier includes a first layer with a relatively high stress-thickness in the range of ?1000 MPa-?m to ?200 MPa-?m and a second layer with a relatively low stress-thickness in the range ?150 MPa-?m to 300 MPa-?m. The second layer compensates for the stress caused by the first, thereby allowing for a barrier that provides good permeation without causing failure of the device due to delamination.