Abstract: A circuit terminating device for mechanically retaining and electrically connecting a planar substrate such as a thick/thin film circuit to a printed wiring card. The terminating device is characterized by a terminating body having planar sidewalls defining a hollow interconnection post receiving area therebetween. A pair of substrate spring members extend from a sidewall of the terminating body arranged to compressively accept an edge of the substrate retaining and connecting the substrate to the terminating body. Post spring members extending inwardly into the post receiving area engage an interconnection post which extends from the printed wiring card thereby retaining the terminating body to the printed wiring card.

Abstract: A circuit terminating clip for mechanically retaining and electrically connecting a planer substrate such as a thick/thin film circuit to a printed wiring card. The terminating clip is characterized by a terminating body having planer sidewalls defining a hollow interconnecting post receiving area therebetween. A substrate spring member extends from a bottom edge of a front wall of the terminating body arranged to accept the edge of the substrate, connecting the substrate to the terminating body. A terminating pad member extending from the top edge of the front wall of the terminating body is soldered to the substrate retaining the terminating body to the substrate. Post spring members extending inwardly into the post receiving area engage an interconnection post which extends from the printed wiring card thereby retaining the terminating body to the printed wiring card.

Abstract: A circuit interconnection device for mechanically retaining and electrically connecting a planer substrate such as a thick/thin film circuit to a printed wiring card. The circuit interconnection device is characterized by a generally rectangular device body having planer sidewalls defining a hollow interconnection post receiving area therebetween. A pair of ears extend from a bottom edge of a front wall arranged to have an edge of the substrate rest thereon. A pair of substrate spring members extend outward from a top edge of the front wall to engage the substrate retaining and connecting the substrate to the terminating body. A rear wall includes a pair of post spring members extending inwardly into the post receiving area engaging an interconnection post extending from the printed wiring card thereby retaining and connecting the terminating body to the printed wiring card.

Abstract: A device arranged to electrically connect and physically attach a hybrid circuit module to a printed wiring card. The device is characterized by a male terminal section arranged to be mounted on a printed wiring card, a compliant section for buffering any flexure or displacement imparted to the hybrid circuit module and a hybrid circuit module accepting section. Additionally, a terminal accepting section is provided disposed to accept the male terminal section of another similar device, allowing the stacking of a plurality of hybrid circuit modules to the printed wiring card.

Abstract: A device is disclosed for mounting, interconnecting and terminating printed circuits. The invention comprises a frame of insulating material including a fixed printed circuit substrate and an area for supporting and confining a removable printed circuit substrate. A connector molded on one end of the frame extends input/output signals to both substrates. A handle molded on a second end of the frame includes slots through which clips are inserted electrically interconnecting the two substrates. The clips also aid in retaining the removable circuit substrate to the frame.

Abstract: A device is disclosed for mounting, interconnecting and terminating printed circuits. The invention comprises a frame of insulating material arranged to support, position and confine two printed circuit substrates. A connector molded on one end of the frame extends input/output signals to both substrates. A handle molded on a second end of the frame includes slots through which clips are inserted electrically interconnecting the two substrates. The clips also aid in retaining both substrates to the frame.

Abstract: The method of forming fine line circuit patterns on an insulating coating comprising the steps of applying an insulating coating to a substrate, forming a circuit pattern on the insulating coating surface, filling the circuit pattern with conductive or resistive circuit paste, removing the excess and heating at a temperature for sintering the paste to the coating.

Abstract: A method of adding fine line circuits to a thick film microcircuit comprising the steps of: cutting a circuit pattern on a substrate; filling the circuit pattern with a conductive or resistive paste and removing the excess; adding screen printing thick film circuit elements on the substrate surface and over selected portions of the fine line pattern; and heating thereby sintering the paste and thick film elements to the substrate.