Abstract: A process and apparatus for precision glass roll forming a supply of molten glass at a glass temperature of 1000° C. or higher with a pair of hot forming rolls having a surface temperature of about 500° C. or higher located vertically below the glass feed. The forming rolls thin the supplied stream of molten glass to produce a formed glass ribbon. A pair of cold sizing and texturing rolls maintained at a surface temperature of about 400° C. or lower or 300° C. or lower is located vertically below the forming rolls. The sizing and texturing rolls thin and texture the formed glass ribbon to produce a sized glass ribbon having a desired texture, thickness and thickness uniformity. The sized and textured glass ribbon may have a thickness of 1 mm or less that varies in thickness by no more than +/?0.025 mm.

Abstract: A multi-screen electronic device includes a first electronic device having a first electronic device screen and a second electronic device having a second electronic device screen. The first and second electronic device screens are stacked and on different planes when the multi-screen electronic device is in a compact form. The first and second electronic device screens are unstacked and on the same plane when the multi-screen electronic device is in an expanded form. A translation mechanism is coupled to the first and second electronic devices. The translation mechanism is configured to guide a motion of at least one of the first and second electronic devices along a nonlinear path such that a travel along the nonlinear path in a forward direction transforms the multi-screen electronic device from the compact form to the expanded form and a travel along the nonlinear path in a reverse direction transforms the multi-screen electronic device from the expanded form to the compact form.

Abstract: Provided herein is a method for producing glass-ceramic sheets. The method includes texturing at least one surface of a first glass sheet, and stacking the first glass sheet and a second glass sheet. The first glass sheet and the second glass sheet are stacked so that the textured surface of the first glass sheet contacts a surface of the second glass sheet. The first and second glass sheets are cerammed. After cooling, the cerammed first and second glass sheets are separated. Also provided is a pre-form for producing glass-ceramic sheets. The pre-form includes a first glass sheet having a textured surface, and a second glass sheet contacting the first glass sheet. The textured surface of the first glass sheet is in contact with a surface of the second glass sheet.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature, providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: A process and apparatus for precision glass roll forming a supply of molten glass at a glass temperature of 1000° C. or higher with a pair of hot forming rolls having a surface temperature of about 500° C. or higher located vertically below the glass feed. The forming rolls thin the supplied stream of molten glass to produce a formed glass ribbon. A pair of cold sizing and texturing rolls maintained at a surface temperature of about 400° C. or lower or 300° C. or lower is located vertically below the forming rolls. The sizing and texturing rolls thin and texture the formed glass ribbon to produce a sized glass ribbon having a desired texture, thickness and thickness uniformity. The sized and textured glass ribbon may have a thickness of 1 mm or less that varies in thickness by no more than +/?0.025 mm.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: A multi-screen electronic device includes a first electronic device having a first electronic device screen and a second electronic device having a second electronic device screen. The first and second electronic device screens are stacked and on different planes when the multi-screen electronic device is in a compact form. The first and second electronic device screens are unstacked and on the same plane when the multi-screen electronic device is in an expanded form. A translation mechanism is coupled to the first and second electronic devices. The translation mechanism is configured to guide a motion of at least one of the first and second electronic devices along a nonlinear path such that a travel along the nonlinear path in a forward direction transforms the multi-screen electronic device from the compact form to the expanded form and a travel along the nonlinear path in a reverse direction transforms the multi-screen electronic device from the expanded form to the compact form.

Abstract: Glass articles for use as covers in electronic devices and methods for forming the same are described herein. The glass articles generally include a shaped glass substrate comprising a first face, a second face and a perimeter edge. The shaped glass substrate may be formed from strengthened glass such that the shaped glass substrate has a compressive stress layer which improves the ability of the glass article to withstand surface damage without cracking. A polymer overmold is coupled to the attachment feature of the perimeter edge of the shaped glass substrate thereby protecting the perimeter edge of the shaped glass substrate from damage. In one embodiment, at least a portion of the perimeter edge of the shaped glass substrate comprises an attachment feature offset from the first face. In another embodiment the polymer overmold is integrally formed with at least one connector.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600° C. or greater is achieved in less than about one-half hour.