Patents by Inventor William F. Cann

William F. Cann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs
    Patent number: 4761518
    Abstract: A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises forming a four-sided semiconductor casing having a leadframe with an aluminum cladding that is etched away at the ends extending from the casing.
    Type: Grant
    Filed: January 20, 1987
    Date of Patent: August 2, 1988
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, William F. Cann