Abstract: An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.

Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

Abstract: The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.

Abstract: The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.

Abstract: A connector comprising an insulating body defining a slot that is adapted to receive a pluggable module. A plurality of conductive pins extend into the slot and at least one extension, coupled to the insulating body, protects the plurality of pins from being shorted by an incorrectly inserted pluggable module.

Abstract: A carrier module is physically compatible with a XENPAK/X2 10 GE slot and includes a socket for accepting a non-XENPAK/X2 module and interface circuitry for providing appropriate signals to a XENPAK/X2 70-pin connector on an interior side of the carrier module. The carrier module includes a cookie, accessible by host software, identifying the type of carrier module and non-XENPAK/X2 module accepted by the carrier card.

Abstract: A connector comprising an insulating body defining a slot that is adapted to receive a pluggable module. A plurality of conductive pins extend into the slot and at least one extension, coupled to the insulating body, protects the plurality of pins from being shorted by an incorrectly inserted pluggable module.

Abstract: A system includes a circuit board module having a device mounting section. The system further includes a small form factor transceiver and a form factor converter. The form factor converter is configured to concurrently connect to (i) the circuit board module and (ii) the small form factor transceiver. The form factor converter includes an exterior portion defining a large form factor (e.g., the standard X2 form factor) to fit within the device mounting section of the circuit board module when the form factor converter connects to the circuit board module, and an interior portion defining a small form factor (e.g., the standard SFP form factor) location to receive at least a portion of the small form factor transceiver when the form factor converter connects to the small form factor transceiver.

Abstract: A system for providing dual 10 GB uplinks in the front side of a single rack unit switch that stacks two MSA X2 I/O devices in a limited space. In one embodiment the two X2 I/O devices are mounted on opposite sides of a single circuit board positioned above the motherboard.

Abstract: A frame or similar structure is used for positioning two stacked GBIC connectors within a 1 RU form factor height of a router or similar network device. In one aspect, the frame can be constructed, assembled and/or mounted in the absence of a need for screws or similar connectors and/or tools. Hooks, latches, engaging teeth and the like can engage sections of a chassis base plate, to position the GBIC connectors preferably within a cutout formed in a motherboard. Use of a flex circuit for connecting the GBIC connectors to a motherboard avoids the requirement for high-precision placement for positioning.

Abstract: An adaptor is provided for effectively converting an opening in the chassis or box of a router (or similar device) from an opening which accommodate a power entry component for a first power type to accommodate a power entry component for a second power type. In one aspect, an adaptor fits in a panel opening which is sized and shaped to receive an IEC-compliant AC power entry component. The adaptor has a window or opening which accommodates, e.g. a four-wire DC power entry component. In one aspect, an adaptor couples to screw holes, such as on either side of an RPS coupler and also receives a standard ground wire log, preferably forming a conductive path from the lug to the screw holes.

Abstract: GBIC frames are mounted with respect to one or another or with respect to the printed circuit board so as to facilitate space sufficiency, e.g. of a front or other panel. In one aspect two GBIC frames are mounted in back-to-back fashion on opposite surfaces of a mounting plate of preferably minimal thickness. Plate cut-outs are positioned to accommodate frame feet or other mounting structures in a fashion off-set, on opposite faces, to avoid interference between frame legs. In one aspect, portions of GBICs and frames are received in cut-out or other edges of a PCB so that GBICs in frames straddle a major surface of a PCB to reduce height for accommodating 1RU or other form factors while increasing space efficiency.