Patents by Inventor William F. Edwards

William F. Edwards has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250254835
    Abstract: The present disclosure is generally directed to a vertical line card configuration with cage assemblies mounted perpendicular to a printed circuit board with an application specific integrated circuit. The cage assembly may include a plurality of pluggable modules arranged in a belly-to-belly configuration. In this configuration, a first pluggable module having an internal heatsink on bottom may be arranged in vertical alignment with a similar but inverted module where the internal heatsink is on top by virtue of the inversion. The vertical cage structure may include riding heatsinks on opposing edges parallel to the internal heatsinks in the pluggable modules. The cage structure may also have a 2×n cage design, including two cage rows of pluggable modules and any number of columns of module pairs.
    Type: Application
    Filed: February 5, 2024
    Publication date: August 7, 2025
    Inventors: Melody Liu, William F. Edwards, JR., Tanya Liu, Cedric Fung Lam, Ayan Majumdar
  • Patent number: 12353340
    Abstract: The disclosure provides for high bandwidth processing through the sharing of memory dies over a plurality of computing dies via an optical interchange. The optical interchange may be configured so as to operate as both an optical switch and optical demultiplexer. The optical switch configuration for the optical interchange allows for data to be written from any computing die to one of a plurality of memory dies via an optical connection. The optical demultiplexer configuration allows for data to be broadcast from a memory die to a plurality of the computing dies.
    Type: Grant
    Filed: July 18, 2023
    Date of Patent: July 8, 2025
    Assignee: Google LLC
    Inventors: Horia Alexandru Toma, Zuowei Shen, William F. Edwards, Jr., Gurushankar Rajamani, Hong Liu, Ilyas Mohammed
  • Publication number: 20250102746
    Abstract: The technology generally relates to high bandwidth memory (HBM) packages and processor packages that have optical connectivity. Disclosed systems and methods herein allow for HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An HBM package can be cooled using a cooling unit that is distinct from the processor package. In addition, the cooling unit can be configured so as to provide thermal contact with a subset of high-power components within the HBM package.
    Type: Application
    Filed: September 26, 2023
    Publication date: March 27, 2025
    Inventors: Horia Alexandru Toma, Zuowei Shen, Ilyas Mohammed, Yingying Wang, William F. Edwards, Jr.
  • Publication number: 20250028661
    Abstract: The disclosure provides for high bandwidth processing through the sharing of memory dies over a plurality of computing dies via an optical interchange. The optical interchange may be configured so as to operate as both an optical switch and optical demultiplexer. The optical switch configuration for the optical interchange allows for data to be written from any computing die to one of a plurality of memory dies via an optical connection. The optical demultiplexer configuration allows for data to be broadcast from a memory die to a plurality of the computing dies.
    Type: Application
    Filed: July 18, 2023
    Publication date: January 23, 2025
    Inventors: Horia Alexandru Toma, Zuowei Shen, William F. Edwards, JR., Gurushankar Rajamani, Hong Liu, Ilyas Mohammed
  • Publication number: 20240290763
    Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.
    Type: Application
    Filed: May 9, 2024
    Publication date: August 29, 2024
    Inventors: Houle Gan, Richard Stuart Roy, Yujeong Shim, William F. Edwards, JR., Chenhao Nan
  • Patent number: 12002795
    Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contacts that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board. An assembly includes the pluggable processor module and a printed circuit board assembly (“PCBA”) including a module aperture that is large enough to receive the power board and narrower than the capacitor board.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: June 4, 2024
    Assignee: Google LLC
    Inventors: Houle Gan, Richard Stuart Roy, Yujeong Shim, William F. Edwards, Jr., Chenhao Nan
  • Publication number: 20230335928
    Abstract: An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 19, 2023
    Inventors: William F. Edwards, JR., Xu Zuo, Ryohei Urata, Melanie Beauchemin, Woon-Seong Kwon, Shinnosuke Yamamoto, Houle Gan, Yujeong Shim
  • Publication number: 20230335541
    Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.
    Type: Application
    Filed: April 13, 2022
    Publication date: October 19, 2023
    Inventors: Houle Gan, Richard Stuart Roy, Yujeong Shim, William F. Edwards, JR., Chenhao Nan
  • Publication number: 20230244046
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: April 6, 2023
    Publication date: August 3, 2023
    Inventors: William F. Edwards, JR., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Patent number: 11650384
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: May 16, 2023
    Assignee: Google LLC
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Publication number: 20220269019
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Inventors: William F. Edwards, JR., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Patent number: 11249264
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: February 15, 2022
    Assignee: Google LLC
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Publication number: 20220003946
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: December 15, 2020
    Publication date: January 6, 2022
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Patent number: 11044834
    Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: June 22, 2021
    Assignee: Google LLC
    Inventors: Michael Chi Kin Lau, William F. Edwards, Jr., Justin S. Lee, Winnie Leung
  • Patent number: 10522280
    Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: December 31, 2019
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: William F. Edwards, George Edward Curtis, Ki Yuen Chau, Sandeep Arvindkumar Patel, Keith Frank Tharp, Robin Carol Johnson, Yu Liu, Billie Alton Hudson
  • Publication number: 20170125149
    Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.
    Type: Application
    Filed: January 17, 2017
    Publication date: May 4, 2017
    Inventors: William F. Edwards, George Edward Curtis, Ki Yuen Chau, Sandeep Arvindkumar Patel, Keith Frank Tharp, Robin Carol Johnson, Yu Liu, Billie Alton Hudson
  • Patent number: 9576716
    Abstract: The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: February 21, 2017
    Assignee: CISCO TECHNOLOGY, INC
    Inventors: William F. Edwards, George Edward Curtis, Ki Yuen Chau, Sandeep Arvindkumar Patel, Keith Frank Tharp, Robin Carol Johnson, Yu Liu, Billie Alton Hudson
  • Publication number: 20150179328
    Abstract: The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.
    Type: Application
    Filed: December 24, 2013
    Publication date: June 25, 2015
    Inventors: William F. Edwards, George Edward Curtis, Ki Yuen Chau, Sandeep Arvindkumar Patel, Keith Frank Tharp, Robin Carol Johnson, Yu Liu, Billie Alton Hudson
  • Patent number: 7625240
    Abstract: A connector comprising an insulating body defining a slot that is adapted to receive a pluggable module. A plurality of conductive pins extend into the slot and at least one extension, coupled to the insulating body, protects the plurality of pins from being shorted by an incorrectly inserted pluggable module.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: December 1, 2009
    Assignee: Cisco Technology, Inc.
    Inventors: Perry L. Hayden, Sr., Peter Lum, William F. Edwards, Jr., Flintstone Yu
  • Patent number: 7620754
    Abstract: A carrier module is physically compatible with a XENPAK/X2 10 GE slot and includes a socket for accepting a non-XENPAK/X2 module and interface circuitry for providing appropriate signals to a XENPAK/X2 70-pin connector on an interior side of the carrier module. The carrier module includes a cookie, accessible by host software, identifying the type of carrier module and non-XENPAK/X2 module accepted by the carrier card.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: November 17, 2009
    Assignee: Cisco Technology, Inc.
    Inventors: Alan Yee, Eric Wiles, James P. Rivers, Sandeep Arvind Patel, William F. Edwards, Jr., Jeffrey Provost