Abstract: A thin film printed board precursor containing a laminate of a dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it.

Abstract: A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it. The method comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness. The laminate may be debossed through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon.

Abstract: A thin thermosetting resin film that is amenable to being subjected to a debossing procedure that debosses a grooved printed circuit pattern thereon with minimal loss of debossment precision of the grooved pattern, which pattern and the grooving can be cured to produce a thermoset resin film that can be employed for eventually generating a printed board. The thermosetting resin film has the following qualities:a) it is designed for shaping by processes such as stamping, compression molding, transfer molding, injection molding, and the like without the need for constraining flow at the edges of the resin film;b) the resin is nonconductive, i.e.

Abstract: Processing of materials and their combination to produce a thin foil-laminated adhesive dielectric thermosetting resin film and the conversion of it by a mechanical debossing procedure to impart a debossed and/or embossed printed circuit pattern directly thereon. A process for compositing a shaped metal foil containing a debossed electrical circuitry pattern and an thin isotropic uncured and ungelled thermosetting resin film and forming an adhesively joined composite conforming essentially to the shape of the predebossed metal foil. The process comprises placing a shaping tool with a surface possessing an embossed electrical circuitry pattern, as described in the prior art, and forcing the shaped surface and a surface of the metal foil into intimate contact to deform the metal foil to assume essentially the shape of the tool surface. The shaped metal foil is separated from contact with the tool surface.