Abstract: A wire bonded semiconductor die in a plastic package having minimal or no wire sweep is provided in which the semiconductor device comprises two different encapsulants. The semiconductor die and the wires including the bonds are completely enveloped by a first encapsulating compound, such as an epoxy resin molding compound like Nitto Denko EP-6045. This first encapsulant serves to protect and lock the wires in an upright position so that no wire sweep occurs during the second encapsulation in which the package body is molded. A second encapsulating molding compound forms the package body through standard transfer molding technique with no modification to existing equipment.