Abstract: Integrated passive component assemblies utilize array shell or array frame receiving structures to isolate and protect discrete passive components and provide a modular configuration for mounting to a substrate. Receiving structure embodiments include a base portion, spacer ribs, and optional side walls. Spacer ribs may be connected or provided in opposing spacer rib portions to effectively isolate adjacent component terminations. Standoff features may be incorporated into select embodiments of the disclosed technology to aid in device mounting and to facilitate post-affixment cleaning and visual termination contact. Discrete passive components in accordance with the present subject matter may include select combinations of resistors, capacitors, inductors, and other suitable devices.

Abstract: Integrated passive component assemblies utilize array shell or array frame receiving structures to isolate and protect discrete passive components and provide a modular configuration for mounting to a substrate. Receiving structure embodiments include a base portion, spacer ribs, and optional side walls. Spacer ribs may be connected or provided in opposing spacer rib portions to effectively isolate adjacent component terminations. Standoff features may be incorporated into select embodiments of the disclosed technology to aid in device mounting and to facilitate post-affixment cleaning and visual termination contact. Discrete passive components in accordance with the present subject matter may include select combinations of resistors, capacitors, inductors, and other suitable devices.

Abstract: A method for manufacturing tantalum capacitors includes preparing a tantalum compact by cold pressing tantalum powder, placing the compact, along with loose refractory metal powder, in a microwave-transparent casket to form an assembly, and heating the assembly for a time sufficient to effect at least partial sintering of the compact and the product made by the method.

Abstract: A method of forming capacitor anodes is described wherein leads of film forming metal, preferably headed are subjected to plasma spray deposition of film forming metal, preferably at a flame temperature of about 10,000.degree. to 20,000.degree. C. to form capacitor anodes.

Abstract: An anode riser assembly for an anode means comprising an anode riser means and polymeric means substantially adhered to the anode riser to minimize the ingression of electrolyte means to the anode riser. The anode riser means is made of a film-forming metal and, preferably, does not have a myriad of intercommunicating voids therein. The polymeric means, preferably a polyester material having affixed thereto the trademark Mylar (a trademark of E.I. du Pont de Nemours & Co., Inc.) which is chemically inert to the action of the electrolyte means and has high dielectric strength, substantially adheres to and follows the surface contour of the anode riser means to provide an interface therebetween into which is minimized the ingression of electrolyte means adapted to be cooperatively associated with the anode means. The anode riser assembly is especially adapted for use with anode means in either a dry or wet electrolytic capacitor.The invention also contemplates a method of making the anode riser assembly.