Patents by Inventor William F. Wiedemann

William F. Wiedemann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130078826
    Abstract: An electrical connector comprising a pair of elongated bodies, each having a facing ramp, the ramp having an notch, each having a rotatable torsion bar conductor with a tip located in the notch, the end of a tip spaced above the ramp such that when the two bodies are mated, the tips engage the ramp of the other connector and rotate against a torsional restoring force, and when fully mated, the two ramps abut each other, notches aligned, with the respective tips of the torsion bars engaging the torsion bar of the other body in the aligned notches.
    Type: Application
    Filed: November 8, 2012
    Publication date: March 28, 2013
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Joseph C. Fjelstad, Rara K. Segaram
  • Patent number: 8338713
    Abstract: An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: December 25, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas Obenhuber, William F. Wiedemann
  • Patent number: 8324727
    Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: December 4, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas J. Obenhuber, Inessa Obenhuber, legal representative
  • Publication number: 20120149250
    Abstract: An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 14, 2012
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasumura, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy
  • Patent number: 8079848
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: December 20, 2011
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram
  • Patent number: 8047855
    Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: November 1, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gary Yasamura, Joseph C. Fjelstad, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy
  • Publication number: 20110171857
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Application
    Filed: March 21, 2011
    Publication date: July 14, 2011
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasumura, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy
  • Patent number: 7909615
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: March 22, 2011
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram
  • Publication number: 20110065332
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Application
    Filed: November 23, 2010
    Publication date: March 17, 2011
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasumura, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy
  • Patent number: 7845986
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Grant
    Filed: May 6, 2005
    Date of Patent: December 7, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy
  • Patent number: 7837477
    Abstract: An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: November 23, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gary Yasamura, Joseph C. Fjelstad, Kevin P. Grundy, William F. Wiedemann, Matthew J. Stepovich
  • Publication number: 20100165525
    Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
    Type: Application
    Filed: March 9, 2010
    Publication date: July 1, 2010
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas J. Obenhuber, Inessa Obenhuber
  • Publication number: 20100151704
    Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
    Type: Application
    Filed: January 25, 2010
    Publication date: June 17, 2010
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasumura, Joseph C. Fjelstad, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy
  • Patent number: 7732904
    Abstract: A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: June 8, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber, legal representative, Kevin P. Grundy, William F. Wiedemann
  • Publication number: 20100127402
    Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.
    Type: Application
    Filed: January 25, 2010
    Publication date: May 27, 2010
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Kevin P. Grundy, Joseph C. Fjelstad, Gary Yasumura, William F. Wiedemann, Para K. Segaram
  • Publication number: 20100112829
    Abstract: An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.
    Type: Application
    Filed: January 4, 2010
    Publication date: May 6, 2010
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasamura, Joseph C. Fjelstad, Kevin P. Grundy, William F. Wiedemann, Matthew J. Stepovich
  • Patent number: 7701323
    Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: April 20, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas J. Obenhuber, Inessa Obenhuber, legal representative
  • Patent number: 7651336
    Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: January 26, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, Joseph C. Fjelstad, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy
  • Patent number: 7651382
    Abstract: An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: January 26, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, Joseph C. Fjelstad, Kevin P. Grundy, William F. Wiedemann, Matthew J. Stepovich
  • Patent number: 7652381
    Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.
    Type: Grant
    Filed: February 9, 2005
    Date of Patent: January 26, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Kevin P. Grundy, Joseph C. Fjelstad, Gary Yasumura, William F. Wiedemann, Para K. Segaram