Abstract: A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.

Abstract: An electrical device includes a flat electrical conductor defining an aperture and an electrically conductive rivet with a body having a layer of a solder composition disposed on a first side and a tubular shaft extending from a second side of the body opposite the first side. A free end of the tubular shaft is flared such that the free end has a diameter larger than a diameter of the aperture.

Abstract: A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.

Abstract: An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

Abstract: A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

Abstract: A resistance soldering system includes a power input receiving an alternating current from a power source and a controller circuit generating a control signal indicative of a desired power level delivered for a desired time. The resistance soldering system further includes a silicon-controlled rectifier connected to the power input and the controller circuit and producing a control voltage proportional to the control signal and a transformer having a primary side receiving the control voltage and a secondary side having output leads configured to apply an output voltage to a solder joint disposed between the output leads. The controller circuit determines the control signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time. The controller circuit controls the desired power level independent of the desired time. A method of operating a resistance soldering system is also presented.

Abstract: An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

Abstract: An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

Abstract: An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.

Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.

Abstract: A lighting assembly includes a circuit board substrate having first and second conductive traces, a light emitting electrical device, and a pair of electrical terminals interconnected to the light emitting electrical device by the first and second conductive traces. The pair of electrical terminals are configured to mechanically secure the lighting assembly to a pair of corresponding electrical terminals mounted on a panel. The pair of electrical terminals are further configured to electrically connect the light emitting electrical device to third and fourth conductive circuit traces disposed on a surface of the panel.

Abstract: An electrical device includes a flat electrical conductor defining an aperture and an electrically conductive rivet with a body having a layer of a solder composition disposed on a first side and a tubular shaft extending from a second side of the body opposite the first side. A free end of the tubular shaft is flared such that the free end has a diameter larger than a diameter of the aperture.

Abstract: A resistance soldering device configured for use with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

Abstract: A resistance soldering system includes a power input receiving an alternating current from a power source and a controller circuit generating a control signal indicative of a desired power level delivered for a desired time. The resistance soldering system further includes a silicon-controlled rectifier connected to the power input and the controller circuit and producing a control voltage proportional to the control signal and a transformer having a primary side receiving the control voltage and a secondary side having output leads configured to apply an output voltage to a solder joint disposed between the output leads. The controller circuit determines the control signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time. The controller circuit controls the desired power level independent of the desired time. A method of operating a resistance soldering system is also presented.

Abstract: A lighting assembly includes a circuit board substrate having first and second conductive traces, a light emitting electrical device, and a pair of electrical terminals interconnected to the light emitting electrical device by the first and second conductive traces. The pair of electrical terminals are configured to mechanically secure the lighting assembly to a pair of corresponding electrical terminals mounted on a panel. The pair of electrical terminals are further configured to electrically connect the light emitting electrical device to third and fourth conductive circuit traces disposed on a surface of the panel.

Abstract: A system or method for manipulating audiovisual data using transcript information. The system or method performs the following actions. Creating a computer-generated transcript of audio data from the audiovisual data, the computer-generated transcript includes a plurality of words, at least some words of the plurality of words are associated with a respective timestamp and a confidence score. Receiving a traditional transcript of the audio data, the traditional transcript includes a plurality of words that are not associated with timestamps. Identifying one or more words from the plurality of words of the computer-generated transcript that match words from the plurality of words of the traditional transcript. Associating the timestamp of the one or more words of the computer-generated transcript with the matching word of the traditional transcript. Processing the audiovisual data using the traditional transcript and the associated timestamps.

Abstract: A power delivery system includes a power-input-channel, an AC/DC converter, one or more controller-circuits, a silicon-controlled-rectifier, a transformer, and a pair of output-leads. The power-input-channel receives alternating-current from a power-source. The AC/DC converter converts the alternating-current to a direct-current at a converter-output. The one or more controller-circuits are connected with the converter-output and control a signal indicative of a desired-power-level delivered for a desired-time. The silicon-controlled-rectifier is connected with the power-input-channel and controls an SCR-output-voltage to an SCR-output-channel proportional to the signal. The transformer reduces the SCR-output-voltage from a primary-side to a secondary-voltage on a secondary-side. The pair of output-leads are connected with poles of the secondary-side. A solder-joint is disposed between the pair of output-leads.

Abstract: A system or method for aligning in time a first transcript to audio data used to create the first transcript. The system or method performs the following actions. Receiving the first transcript. The first transcript includes a first plurality of words that are in the audio data. Transcribing the audio data to make a second transcript. The second transcript includes a second plurality of words that are in the audio data and a respective time of a location in the audio data of each word of the second plurality. For each word of the second plurality found in the first plurality, assigning the respective time of the location of the word of the second plurality to the word of the first plurality thereby aligning in time the first transcript to the audio data.

Abstract: A power delivery system includes a power-input-channel, an AC/DC converter, one or more controller-circuits, a silicon-controlled-rectifier, a transformer, and a pair of output-leads. The power-input-channel receives alternating-current from a power-source. The AC/DC converter converts the alternating-current to a direct-current at a converter-output. The one or more controller-circuits are connected with the converter-output and control a signal indicative of a desired-power-level delivered for a desired-time. The silicon-controlled-rectifier is connected with the power-input-channel and controls an SCR-output-voltage to an SCR-output-channel proportional to the signal. The transformer reduces the SCR-output-voltage from a primary-side to a secondary-voltage on a secondary-side. The pair of output-leads are connected with poles of the secondary-side. A solder-joint is disposed between the pair of output-leads.