Patents by Inventor William Ferrante

William Ferrante has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070113134
    Abstract: Reporting and/or analyzing test data from a plurality of tests of an array structure using a data array is disclosed. One method includes obtaining the test data, and reporting the test data in a data array, which includes at least two portions representing different tests. Data stored in the data array is organized according to a translation table, which describes the locations of data for tests and criteria for data to be analyzed within the data array. Numerous other data arrangements such as a coordinate file listing a pre-defined maximum number of fail points, or a chip report including fail points by chip may also be generated. The data array reports all test data in a more easily generated and stored form, and may be converted to an image. A data analysis method for analyzing data using the data array is also disclosed.
    Type: Application
    Filed: October 21, 2005
    Publication date: May 17, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William Ferrante, John Cassels, Stephen Wu
  • Publication number: 20060006166
    Abstract: An on-chip temperature control system includes a temperature sensor, which monitors a temperature of a chip, and a hysteresis comparator which checks whether the temperature is in an acceptable range. A reference adjustment circuit is responsive to the hysteresis comparator to adjust an on-chip voltage to control the temperature locally by adjusting a local supply voltage, if the temperature is out of range.
    Type: Application
    Filed: July 6, 2004
    Publication date: January 12, 2006
    Inventors: Howard Chen, William Ferrante, Louis Hsu, Carl Radens
  • Publication number: 20050151213
    Abstract: A structure and method are provided for forming a thermistor. Isolation structures are formed in a substrate including at least an upper layer of a single crystal semiconductor. A layer of salicide precursor is deposited over the isolation region and the upper layer. The salicide precursor is then reacted with the upper layer to form a salicide self-aligned to the upper layer. Finally, the unreacted portions of the salicide precursor are then removed while preserving a portion of the salicide precursor over the isolation region as a body of the thermistor. An alternative integrated circuit thermistor is formed from a region of thermistor material in an embossed region of an interlevel dielectric (ILD).
    Type: Application
    Filed: January 8, 2004
    Publication date: July 14, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jon Casey, William Ferrante, Edward Kiewra, Carl Radens, William Tonti