Patents by Inventor William G. Busby

William G. Busby has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6343823
    Abstract: A vacuum-actuated tool for handling of small articles, such as electronic devices or lenses, having an improved valve mechanism including a valve stem located at an angled position that is less than 90° relative to a longitudinal axis of a body of the tool, a pivotable shell, a grip and angled handle for comfortable control and manipulation of the tool. A spring coil biases the valve stem into an upward position such that a first O-ring fixed to the stem seals a forward passageway to the atmosphere and such that evacuation occurs from said forward passageway to a co-axial rearward passageway permitting retrieval of an item. When the pivotable shell is depressed the spring bias is overcome and the first O-ring moves downward permitting atmospheric air into the forward chamber releasing the retrieved item. A second O-ring blocks fluid communication between the forward passageway and the rearward passageway and vacuum source when the pivotable shell is depressed.
    Type: Grant
    Filed: October 23, 2000
    Date of Patent: February 5, 2002
    Inventor: William G. Busby
  • Patent number: 6095335
    Abstract: A size-convertible device for supporting wafers in a parallel relationship includes a removable insert that enables the device to be non-destructively switched from providing edge support for large diameter wafers to providing edge support for small diameter wafers. The insert maintains the original wafer pitch and the original insertion angle. In the preferred embodiment, the device is a Front Opening Unified Pod (FOUP) specifically designed for use with 300 mm diameter wafers. Inserts are releasably attached to opposite sides of the FOUP to convert the device to a 200 mm diameter pod. The axis of the rest positions of the small wafers is coaxial with the rest positions of the large wafers. However, the inserts may be adapted to move the rest positions of the small wafers forwardly to a position such that there is front edge alignment with respect to rest positions of the large and small wafers.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: August 1, 2000
    Assignee: H-Square Corporation
    Inventor: William G. Busby
  • Patent number: 5169192
    Abstract: A vacuum-actuated tool for handling of electronic articles, such as integrated circuit chips, wherein the tool includes an elongated body having first, second, and third passageways. The second passageway is connected to a vacuum source, while the first passageway leads to a pickup tip that contacts the article to be handled. Positive pressure sealing provides a leak-proof closure of the second passageway when the article is to be released. The third passageway is in fluid communication with the atmosphere and is linked to the first passageway simultaneously with the positive pressure sealing of the second passageway. In a pickup position, the third passageway to the atmosphere is pressure sealed to prevent leakage through the third passageway to the atmosphere. The pressure seals are provided by elastomeric members.
    Type: Grant
    Filed: June 28, 1991
    Date of Patent: December 8, 1992
    Assignee: H-Square Corporation
    Inventors: Quincy D. Allison, William G. Busby