Patents by Inventor William G. Loder

William G. Loder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip integrated circuit package
    Patent number: 5777345
    Abstract: An electronic package which has a plurality of stacked integrated circuit dies. The package includes a first die that is mounted to a die paddle of a lead frame. The first die is also connected to the leads of the lead frame by bond wires. A second die is mounted to the top surface of the first die and electrically connected to the first die with bond wires. The first die, second die and die paddle are all enclosed by a package.
    Type: Grant
    Filed: January 3, 1996
    Date of Patent: July 7, 1998
    Assignee: Intel Corporation
    Inventors: William G. Loder, John Francis McMahon