Patents by Inventor William G. McDonald
William G. McDonald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9146170Abstract: An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.Type: GrantFiled: July 31, 2012Date of Patent: September 29, 2015Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Jian Wen, William G. McDonald
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Patent number: 9021689Abstract: A method of forming a dual port pressure sensor includes forming a first opening and a second opening in a flag of a lead frame. An encapsulant is molded to hold the lead frame in which the encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag and a second opening in the encapsulant aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag to cover the first opening in the flag, wherein the pressure sensor transducer provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag. The integrated circuit is electrically coupled to the pressure sensor. A lid is attached to the encapsulant to form an enclosure around the bottom of the flag.Type: GrantFiled: June 2, 2011Date of Patent: May 5, 2015Assignee: Freescale Semiconductor, Inc.Inventors: Stephen R. Hooper, William G. McDonald
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Patent number: 8742555Abstract: A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.Type: GrantFiled: August 30, 2011Date of Patent: June 3, 2014Inventors: Jian Wen, Darrel R. Frear, William G. McDonald
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Patent number: 8686550Abstract: A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.Type: GrantFiled: February 13, 2012Date of Patent: April 1, 2014Assignee: Freescale Semiconductor, Inc.Inventors: William G. McDonald, Alexander M. Arayata, Philip H. Bowles, Stephen R. Hooper
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Publication number: 20140033814Abstract: An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.Type: ApplicationFiled: July 31, 2012Publication date: February 6, 2014Inventors: Jian Wen, William G. McDonald
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Publication number: 20130207207Abstract: A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.Type: ApplicationFiled: February 13, 2012Publication date: August 15, 2013Inventors: William G. McDonald, Alexander M. Arayata, Philip H. Bowles, Stephen R. Hooper
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Patent number: 8476087Abstract: Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.Type: GrantFiled: April 21, 2011Date of Patent: July 2, 2013Assignee: Freescale Semiconductor, Inc.Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
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Publication number: 20130049181Abstract: A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.Type: ApplicationFiled: August 30, 2011Publication date: February 28, 2013Inventors: Jian Wen, Darrel R. Frear, William G. McDonald
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Patent number: 8384168Abstract: Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.Type: GrantFiled: April 21, 2011Date of Patent: February 26, 2013Assignee: Freescale Semiconductor, Inc.Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
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Patent number: 8359927Abstract: A method and apparatus are described for fabricating an exposed differential pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a differential pressure sensor transducer die (31) from corrosive particles using a molding compound (39), but which vents both sides of a piezoresistive transducer sensor diaphragm (33) through a first vent hole (42) formed in an exposed die flag (36) and a second vent hole (38) formed in an exposed cap structure (33), enabling the sensor diaphragm (33) to sense differential pressure variations directly or indirectly through a protective gel.Type: GrantFiled: August 12, 2009Date of Patent: January 29, 2013Assignee: Freescale Semiconductor, Inc.Inventors: Stephen R. Hooper, James D. MacDonald, William G. McDonald
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Publication number: 20120304452Abstract: A method of forming a dual port pressure sensor includes forming a first opening and a second opening in a flag of a lead frame. An encapsulant is molded to hold the lead frame in which the encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag and a second opening in the encapsulant aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag to cover the first opening in the flag, wherein the pressure sensor transducer provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag. The integrated circuit is electrically coupled to the pressure sensor. A lid is attached to the encapsulant to form an enclosure around the bottom of the flag.Type: ApplicationFiled: June 2, 2011Publication date: December 6, 2012Inventors: STEPHEN R. HOOPER, William G. McDonald
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Publication number: 20120304777Abstract: A dual port pressure sensor has a lead frame having a flag having a first opening and a second opening. The lead frame has a flag having a first opening and a second opening. An encapsulant holds the lead frame. The encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag, and a second opening in the encapsulant is aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag and covers the first opening in the flag and provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag and is electrically coupled to the pressure sensor. A lid forming an enclosure with the bottom of the flag.Type: ApplicationFiled: June 2, 2011Publication date: December 6, 2012Inventors: STEPHEN R. HOOPER, William G. McDonald
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Patent number: 8307714Abstract: A dual port pressure sensor has a lead frame having a flag having a first opening and a second opening. The lead frame has a flag having a first opening and a second opening. An encapsulant holds the lead frame. The encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag, and a second opening in the encapsulant is aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag and covers the first opening in the flag and provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag and is electrically coupled to the pressure sensor. A lid forming an enclosure with the bottom of the flag.Type: GrantFiled: June 2, 2011Date of Patent: November 13, 2012Assignee: Freescale Semiconductor, Inc.Inventors: Stephen R. Hooper, William G. McDonald
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Publication number: 20120266684Abstract: Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.Type: ApplicationFiled: April 21, 2011Publication date: October 25, 2012Applicant: Freescale Semiconductor, Inc.Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
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Publication number: 20120270354Abstract: Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.Type: ApplicationFiled: April 21, 2011Publication date: October 25, 2012Applicant: Freescale Semiconductor, Inc.Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
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Publication number: 20110173910Abstract: Composite roofing boards and methods for installing a composite roofing board are presented herein. In one embodiment, the roofing board comprises at least nine layers: two outer polymeric layers; two adhesive layers disposed between the two outer polymeric layers; two inner polymeric layers disposed between the two adhesive layers; and a substrate layer disposed between the two inner polymeric layers. A polymeric adhesive, such as an acrylate-polymer adhesive, is preformed on an outer surface of the first and/or second outer polymeric layer. A removable release liner, such as a siliconized polyester film, covers the polymeric adhesive.Type: ApplicationFiled: January 21, 2010Publication date: July 21, 2011Applicant: Pactiv CorporationInventors: Kenneth Franklin, William G. McDonald
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Patent number: 7900521Abstract: A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.Type: GrantFiled: February 10, 2009Date of Patent: March 8, 2011Assignee: Freescale Semiconductor, Inc.Inventors: Stephen R. Hooper, James D. MacDonald, William G. McDonald
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Publication number: 20110036174Abstract: A method and apparatus are described for fabricating an exposed differential pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a differential pressure sensor transducer die (31) from corrosive particles using a molding compound (39), but which vents both sides of a piezoresistive transducer sensor diaphragm (33) through a first vent hole (42) formed in an exposed die flag (36) and a second vent hole (38) formed in an exposed cap structure (33), enabling the sensor diaphragm (33) to sense differential pressure variations directly or indirectly through a protective gel.Type: ApplicationFiled: August 12, 2009Publication date: February 17, 2011Inventors: Stephen R. Hooper, James D. MacDonald, William G. McDonald
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Publication number: 20100199777Abstract: A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.Type: ApplicationFiled: February 10, 2009Publication date: August 12, 2010Inventors: Stephen R. Hooper, James D. MacDonald, William G. McDonald
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Patent number: 7713781Abstract: Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.Type: GrantFiled: September 10, 2008Date of Patent: May 11, 2010Assignee: Freescale Semiconductor, Inc.Inventors: James J. Wang, William G. McDonald