Patents by Inventor William G. Nurge

William G. Nurge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip module having content addressable memory
    Patent number: 6864122
    Abstract: A monolithic Multi-chip Module (MCM) package includes two or more individual CAM dice mounted on a substrate formed as, for example, a plastic ball grid array (PBGA) package. The substrate includes an interconnect structure to route signals between corresponding pads of the CAM dice and balls of the MCM package. In some embodiments, the footprint of the MCM ball grid array package is identical to the footprint of a similar PBGA package housing a single CAM die. Each CAM die within the MCM package may be assigned the same device identification number (DID).
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: March 8, 2005
    Assignee: NetLogic Microsystems, Inc.
    Inventors: Charles C. Huse, William G. Nurge, Varadarajan Srinivasan
  • Multi-chip module having content addressable memory
    Patent number: 6521994
    Abstract: A monolithic Multi-chip Module (MCM) package includes two or more individual CAM dice mounted on a substrate formed as, for example, a plastic ball grid array (PBGA) package. The substrate includes an interconnect structure to route signals between corresponding pads of the CAM dice and balls of the MCM package. In some embodiments, the footprint of the MCM ball grid array package is identical to the footprint of a similar PBGA package housing a single CAM die. Each CAM die within the MCM package may be assigned the same device identification number (DID).
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: February 18, 2003
    Assignee: NetLogic Microsystems, Inc.
    Inventors: Charles C. Huse, William G. Nurge, Varadarajan Srinivasan