Abstract: A connector device may be provided. The connector device may comprise a first electrical connector and a second electrical connector. A body may be disposed between the first electrical connector and the second electrical connector. An electrical pathway may be disposed in the body between the first electrical connector and the second electrical connector.

Abstract: A three-piece electronics enclosure may be provided. The electronics enclosure may comprise a back housing, a lid, and a center frame. The back housing may comprise back housing heat sinks on an exterior of the back housing and back housing circuitry disposed in an interior of the back housing. The lid may comprise lid heat sinks on an exterior of the lid and lid circuitry disposed in an interior of the lid. The center frame may be disposed between the back housing and the lid. The center frame may comprise a plurality of input/output (I/O) ports comprising a first I/O port and a second I/O port. At least one of the plurality of I/O ports may provide power to the back housing circuitry and the lid circuitry. The center frame may further comprise a power bypass that passes power between the first I/O port and the second I/O port.

Abstract: A three-piece electronics enclosure may be provided. The electronics enclosure may comprise a back housing, a lid, and a center frame. The back housing may comprise back housing heat sinks on an exterior of the back housing and back housing circuitry disposed in an interior of the back housing. The lid may comprise lid heat sinks on an exterior of the lid and lid circuitry disposed in an interior of the lid. The center frame may be disposed between the back housing and the lid. The center frame may comprise a plurality of input/output (I/O) ports comprising a first I/O port and a second I/O port. At least one of the plurality of I/O ports may provide power to the back housing circuitry and the lid circuitry. The center frame may further comprise a power bypass that passes power between the first I/O port and the second I/O port.

Abstract: A connector device may be provided. The connector device may comprise a first electrical connector and a second electrical connector. A body may be disposed between the first electrical connector and the second electrical connector. An electrical pathway may be disposed in the body between the first electrical connector and the second electrical connector.

Abstract: A container may be provided. The container may comprise a seizure assembly, a housing, a circuit board, and a pin connector. The seizure assembly may comprise a retainer, a pressure applicator, and a charger. The retainer may comprise a casing and a nose with a nose opening. The charger may apply a force to the pressure applicator forcing the pressure applicator into the casing. The housing may comprise a housing cavity in which the seizure assembly is disposed, a housing wall comprising a housing opening that may be congruent with the nose opening, and a housing bottom comprising a charger recess in which the charger is disposed. The circuit board may be disposed in the housing cavity and may have an extender comprising a body and a head. The pin connector may be disposed in the housing wall and have a pin disposed between the pressure applicator and the head.

Abstract: Aspects of the embodiments are directed to an optics module including a top-side inner wall and a bottom-side inner wall. The optics module may include a receiving element for receiving a small form factor pluggable (SFP) device; a heat sink including a first portion, the first portion including a top side and a bottom side, the bottom side of the heat sink in contact with the receiving element; and a first springing element residing between the first portion of the heat sink and the top-side inner wall of the optics module, the first springing element configured to bias the top side of the first portion of the heat sink onto the receiving element. In some embodiments, the optics module also includes a thermal interface material residing between the bottom-side inner wall of the optics module and the second portion of the heat sink, the thermal interface material configured to establish a thermal conduction path between the bottom-side inner wall of the optics module and the heat sink.