Patents by Inventor William Gerald Wyatt
William Gerald Wyatt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8665595Abstract: An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.Type: GrantFiled: May 16, 2006Date of Patent: March 4, 2014Assignee: OL Security Limited Liability CompanyInventors: William Gerald Wyatt, Gary J. Schwartz
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Patent number: 8341965Abstract: A method for cooling a structure includes flowing a saturated refrigerant through one or more passageways in the structure while maintaining the refrigerant at a substantially constant pressure. The method also includes evaporating at least a portion of the refrigerant at a substantially constant temperature throughout the passageways in the structure.Type: GrantFiled: June 24, 2004Date of Patent: January 1, 2013Assignee: Raytheon CompanyInventors: Donald C. Price, William Gerald Wyatt, Gary J. Schwartz
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Patent number: 7254957Abstract: According to one embodiment, an apparatus includes a fluid coolant and structure which reduces a pressure of the fluid coolant through a subambient pressure at which the coolant has a cooling temperature less than a temperature of the heat-generating structure. The apparatus also includes structure that directs a flow of the fluid coolant in the form of a liquid at a subambient pressure in a manner causing the liquid coolant to be brought into thermal communication with the heat-generating structure. The heat from the heat-generating structure causes the liquid coolant to boil and vaporize so that the coolant absorbs heat from the heat-generating structure as the coolant changes state. The structure is configured to circulate the fluid coolant through a flow loop while maintaining the pressure of the fluid coolant within a range having an upper bound less than ambient pressure.Type: GrantFiled: February 15, 2005Date of Patent: August 14, 2007Assignee: Raytheon CompanyInventors: Richard Martin Weber, William Gerald Wyatt
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Patent number: 7246658Abstract: A heat exchanger extracts heat from a two-phase fluid coolant so that the coolant changes from a vapor state to a liquid state. Two valves have respective inlets which communicate with the coolant in the heat exchanger, and which are physically spaced from each other. Valve control structure responds to the presence of liquid at the inlet to either valve by opening that valve, so that the liquid coolant flows through the valve to a discharge section. A different feature involves a housing with a heat exchanger therein, the heat exchanger having a plurality of coolant conduits that are axially spaced. A flow of air travels axially within the housing, then flows transversely past the conduits to the other side thereof, and then resumes flowing axially on the other side of the conduits.Type: GrantFiled: October 31, 2003Date of Patent: July 24, 2007Assignee: Raytheon CompanyInventors: William Gerald Wyatt, James L. Haws, Richard M. Weber
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Patent number: 7130189Abstract: A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section directs a fluid flow along the axis and the thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.Type: GrantFiled: August 29, 2005Date of Patent: October 31, 2006Assignee: Raytheon CompanyInventors: William Gerald Wyatt, Gary J. Schwartz
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Patent number: 7046515Abstract: An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.Type: GrantFiled: June 6, 2002Date of Patent: May 16, 2006Assignee: Raytheon CompanyInventors: William Gerald Wyatt, Gary J. Schwartz
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Patent number: 6972950Abstract: A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section directs a fluid flow along the axis and the thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.Type: GrantFiled: June 6, 2002Date of Patent: December 6, 2005Assignee: Raytheon CompanyInventors: William Gerald Wyatt, Gary J. Schwartz
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Patent number: 6957550Abstract: A cooling technique involves: reducing a pressure of a cooling fluid to a subambient pressure at which the cooling fluid has a boiling temperature less than a temperature of a heat-generating structure; bringing the cooling fluid at the subambient pressure into thermal communication with the heat-generating structure, so that the coolant absorbs heat, boils and vaporizes; thereafter removing heat from the coolant so as to condense substantially all of the coolant to a liquid; and thereafter extracting a selected portion of the cooling fluid that has been cooled, the selected portion being a vapor that includes a non-condensable gas.Type: GrantFiled: May 19, 2003Date of Patent: October 25, 2005Assignee: Raytheon CompanyInventors: William Gerald Wyatt, Richard M. Weber
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Patent number: 6937471Abstract: An apparatus includes a circuit having a heat-generating circuit component, and structure for guiding a two-phase coolant along a path which brings the coolant into direct physical contact with either the circuit component or a highly thermally conductive part which is thermally coupled to the circuit component. The coolant absorbs heat generated by the circuit component, at least part of the coolant changing from a first phase to a second phase in response to the heat absorbed from the circuit component, where the second phase is different from the first phase.Type: GrantFiled: July 11, 2002Date of Patent: August 30, 2005Assignee: Raytheon CompanyInventors: James L. Haws, William Gerald Wyatt, James F. Kviatkofsky, David B. Denniston
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Publication number: 20040231351Abstract: A cooling technique involves: reducing a pressure of a cooling fluid to a subambient pressure at which the cooling fluid has a boiling temperature less than a temperature of a heat-generating structure; bringing the cooling fluid at the subambient pressure into thermal communication with the heat-generating structure, so that the coolant absorbs heat, boils and vaporizes; thereafter removing heat from the coolant so as to condense substantially all of the coolant to a liquid; and thereafter extracting a selected portion of the cooling fluid that has been cooled, the selected portion being a vapor that includes a non-condensable gas.Type: ApplicationFiled: May 19, 2003Publication date: November 25, 2004Inventors: William Gerald Wyatt, Richard M. Weber
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Patent number: 6578625Abstract: A cooling system (10) includes a member (26A, 26B) with an opening (27) therethrough, and includes first and second heat-conductive sections (21, 22) disposed adjacent the member on opposite sides thereof. A fluid supply section (41) is disposed on a side of the first section opposite from the member, and directs a flow of fluid (111-114) toward the first section. A portion (111, 114) of the fluid flows through the first section, and a different portion (112, 113) of the fluid flows through the other section.Type: GrantFiled: March 8, 2002Date of Patent: June 17, 2003Assignee: Raytheon CompanyInventors: William Gerald Wyatt, Jeffrey A. Gilstrap, Gary J. Schwartz