Abstract: An evaporative cooler having a pressurized water distribution system that provides even water distribution to evaporative media pads within the evaporative cooler, even when the evaporative pads are canted and/or are not in perfect alignment. In one embodiment, the evaporative cooler includes a weatherproof sealing assembly that is transitionable between an open position and a closed position. In one embodiment, the evaporative cooler includes a reservoir having a plurality of ribs on a bottom surface to facilitate seating the evaporative cooler on a roof during installation. A method of installing an evaporative cooler including mounting at least a portion of the evaporative cooler to a dropper before securing the dropper to the roof.

Abstract: A dispense arm device for controllably discharging a fluid onto a substrate includes a dispense head coupled to and contained within an arm portion of the dispense arm device, wherein the dispense head having a valve assembly that is configured to operate in: (1) a recirculation mode in which a dispense outlet formed in the dispense head is closed off and a recirculation path is opened for allowing heated chemistry that is delivered to the dispense head to be delivered back from the dispense head to a remote location (e.g., a recycle tank); and (2) a dispense mode in which the dispense outlet is opened to allow heated chemistry to be discharged from the dispense head and the recirculation path is closed off.

Abstract: An evaporative cooler having a pressurized water distribution system that provides even water distribution to evaporative media pads within the evaporative cooler, even when the evaporative pads are canted and/or are not in perfect alignment. The pressurized water distribution system generally includes a distribution assembly with a pressurized flow path portion and a non-pressurized flow path portion, and a supply assembly. The evaporative cooler may also include other features that enhance aesthetics and/or cooling capacity, such as supplemental evaporative media pads, a perforated lid, an internal retaining frame, angled louvers, and/or a dropper that allows for a low-profile installation on a roof of a building or other structure.

Abstract: A directionally adjustable mounting device is disclosed for use with a small electronic device such as a wireless camera. Also disclosed is a method of using the mounting device. The mounting device has a housing for receiving the camera extending from and rotatable about bearing. A socket of the housing is biased into frictional contact with the bearing by a spring to inhibit movement of the camera relative to the bearing. The mount is configured to receive an opposing force on the housing to overcome the spring force and allow the camera to be repositioned.

Abstract: An indirect evaporative cooler core is manufactured from a continuous sheet of hydrophobic material. Flocking is provided on at least a partial surface area of at least one side of the sheet, to render the flocked surface area wettable. Air flow guiding structures are formed upon at least one of the first side and the second side of the sheet. Fold lines are defined in the sheet defining plates extending between adjacent fold lines. Slits are formed along the fold lines. Accordion pleating the sheet at the fold lines forms alternating wet and dry passages between the plates, the wet passages formed between opposing wettable surfaces, the dry passages formed between non-flocked surfaces, and the accordion pleating causes the slits in the folds to open and form air inlets and outlets in communication with the air flow passages.

Abstract: A housing of a wafer processing system includes at least one chamber exhaust outlet and at least one chemical exhaust outlet. The chamber exhaust outlet is formed in the housing for venting gas from the interior of the housing and the chemical exhaust outlet is formed in the housing for venting gas that flows along at least one of: (a) a first flow path defined between the splash shield in a raised position and the collection trays in the lowered position; and (b) a second flow path in which the gas flows through the collection chamber to the chemical exhaust outlet.

Abstract: A reconfigurable wafer spin chuck for supporting a wafer includes a rotatable chuck base having a first opening formed therein and including one or more support members extending upwardly therefrom. The spin chuck is reconfigurable between a first chuck type and a second chuck type, wherein the first chuck type comprises a non-contact wafer type chuck and the second chuck type comprises an open backside frame type chuck. In the non-contact wafer type chuck, a first insert is mounted to the chuck base and supported by the one or more support members and in the open backside frame type chuck, a second insert is mounted to the chuck base and supported by the one or more support members. The wafer is spaced a first distance from the first insert and is spaced a second distance from the second insert, the second distance being greater than the first distance.

Abstract: An indirect evaporative cooling system with a core greatly reduced in size compared to conventional evaporative cooling systems The system has a heat exchanger core having heat exchange plates defining a plurality of wet air flow passages and a plurality of dry air flow passages. At least one fan drives air through the passages. The dry air passages have a small height and a short length, configured so that a substantially laminar airflow having a raised shear rate arises in the dry air passages, and so that a back pressure across a length of the dry air passages remains low.

Abstract: A directionally adjustable mounting device is disclosed for use with a small electronic device such as a wireless camera. Also disclosed is a method of using the mounting device. The mounting device has a mounting rod extending from a rotatable bearing. The hearing is biased into frictional contact with a socket by a spring to inhibit movement of the camera relative to the mount housing. The mount is configured to receive an opposing force on the bearing to overcome the spring force and allow the electronic device to be repositioned.

Abstract: A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer. By spinning this outer ring at high speed, centrifugal force causes these drops to be pulled off of the wafer and flung radially outward, thus preventing the liquid from affecting the backside of the wafer.

Abstract: A directionally adjustable mounting device is disclosed for use with a small electronic device such as a wireless camera. Also disclosed is a method of using the mounting device. The mounting device has a mounting rod extending from a rotatable bearing. The hearing is biased into frictional contact with a socket by a spring to inhibit movement of the camera relative to the mount housing. The mount is configured to receive an opposing force on the bearing to overcome the spring force and allow the electronic device to be repositioned.

Abstract: An indirect evaporative cooler core is manufactured from a continuous sheet of hydrophobic material. Flocking is provided on at least a partial surface area of at least one side of the sheet, to render the flocked surface area wettable. Air flow guiding structures are formed upon at least one of the first side and the second side of the sheet. Fold lines are defined in the sheet defining plates extending between adjacent fold lines. Slits are formed along the fold lines. Accordion pleating the sheet at the fold lines forms alternating wet and dry passages between the plates, the wet passages formed between opposing wettable surfaces, the dry passages formed between non-flocked surfaces, and the accordion pleating causes the slits in the folds to open and form air inlets and outlets in communication with the air flow passages.

Abstract: A two-level tape frame rinse assembly is configured for grasping the substrate so as to create a gap between the substrate and a backside support plate that allows the backside of the wafer to be rinsed and spun dry after rinsing.

Abstract: A high velocity spray (HVS) dispense arm assembly is configured to provide a gas shield nozzle that is arranged to dispense (blow) compressed gas out circumferentially around the HVS dispense arm to reduce or eliminate mist from contacting surfaces above the substrate being treated within process equipment.

Abstract: The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet is fluidly isolated from the chamber exhaust outlet.

Abstract: An indirect evaporative cooling system with a core greatly reduced in size compared to conventional evaporative cooling systems The system has a heat exchanger core having heat exchange plates defining a plurality of wet air flow passages and a plurality of dry air flow passages. At least one fan drives air through the passages. The dry air passages have a small height and a short length, configured so that a substantially laminar airflow having a raised shear rate arises in the dry air passages, and so that a back pressure across a length of the dry air passages remains low.

Abstract: The collection chamber apparatus acts to separate multiple fluids during the wafer processing cycle. Round, fluid collection trays surround the round wafer to collect each individual fluid, recycling them for later reuse. The trays move up and down by use of air cylinders and stack into each other to prevent cross contamination of the other fluids. Two opposing pistons (air cylinders) lift the trays in pairs to form fluid collection chambers. Each collection chamber has a unique drain which enters a separation manifold, flowing into separate tanks for later reuse.

Abstract: The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.