Patents by Inventor William Goldfarb

William Goldfarb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080036464
    Abstract: A probe adapted for characterization of a semiconductor wafer having a surface. In one embodiment, the probe includes a source of modulated light; an optical fiber in optical communication with the source of modulated light, the optical fiber having a face and comprises a fiber core; and a transparent conductive layer coating the face of the optical fiber. Light from the source of modulated light is directed along the fiber core of the optical fiber through the face of the optical fiber to the surface of the semiconductor wafer. The optically transparent conductive layer detects charges from the surface of the semiconductor wafer.
    Type: Application
    Filed: July 27, 2007
    Publication date: February 14, 2008
    Applicant: QC Solutions, Inc.
    Inventors: Kenneth Steeples, Edward Tsidilkovski, William Goldfarb
  • Patent number: 7104743
    Abstract: A vacuum receiver for a pneumatic conveyor for conveying, e.g., plastic pellets, having a receiving vessel with a material inlet, a material outlet and a conveying gas outlet. A first valve member is provided for opening and closing the conveying gas outlet, and a second valve member is provided for opening and closing the material outlet. Both valve members are connected to a common valve shaft and actuated by a single actuator mounted on a vessel lid. The vacuum receiver of the invention has the advantage of affording positive control and sealing of the material discharge valve while at the same time being economical to manufacture and easily cleaned.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: September 12, 2006
    Assignee: Universal Dynamics, Inc.
    Inventors: Donald D. Rainville, Robert R. Crawford, Leonard Paquette, William Goldfarb
  • Publication number: 20050019108
    Abstract: A vacuum receiver for a pneumatic conveyor for conveying, e.g., plastic pellets, having a receiving vessel with a material inlet, a material outlet and a conveying gas outlet. A first valve member is provided for opening and closing the conveying gas outlet, and a second valve member is provided for opening and closing the material outlet. Both valve members are connected to a common valve shaft and actuated by a single actuator mounted on a vessel lid. The vacuum receiver of the invention has the advantage of affording positive control and sealing of the material discharge valve while at the same time being economical to manufacture and easily cleaned.
    Type: Application
    Filed: June 22, 2004
    Publication date: January 27, 2005
    Applicant: Universal Dynamics, Inc.
    Inventors: Donald Rainville, Robert Crawford, Leonard Paquette, William Goldfarb
  • Patent number: 6594002
    Abstract: A method to determine the systematic error of an instrument that measures features of a semiconductor wafer includes the following sequential steps. Collecting sensor data from measurement runs on front and back surfaces of a wafer while the wafer is oriented at different angles to the instrument for each run, yielding a front data set and a back data set for each angle. Then organizing the data in each set into a wafer-fixed coordinate frame. Reflecting all back surface data about a diameter of the wafer creates a reflected back data set. Subtracting the reflected back data from the front data for each wafer angle, and dividing the result by two, yields an averaged wafer shape for each load angle. Adding the reflected back data to the front data and dividing the result by two, yields an instrument signature for each load angle. The symmetric corrector is calculated by taking the average over all instrument signatures at each load angle.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: July 15, 2003
    Assignee: Ade Corporation
    Inventors: William Drohan, William Goldfarb, Peter Harvey, Jaydeep Sinha
  • Publication number: 20020017911
    Abstract: A method to determine the systematic error of an instrument that measures features of a semiconductor wafer includes the following sequential steps. Collecting sensor data from measurement runs on front and back surfaces of a wafer while the wafer is oriented at different angles to the instrument for each run, yielding a front data set and a back data set for each angle. Then organizing the data in each set into a wafer-fixed coordinate frame. Reflecting all back surface data about a diameter of the wafer creates a reflected back data set. Subtracting the reflected back data from the front data for each wafer angle, and dividing the result by two, yields an averaged wafer shape for each load angle. Adding the reflected back data to the front data and dividing the result by two, yields an instrument signature for each load angle. The symmetric corrector is calculated by taking the average over all instrument signatures at each load angle.
    Type: Application
    Filed: July 31, 2001
    Publication date: February 14, 2002
    Inventors: William Drohan, William Goldfarb, Peter Harvey, Jaydeep Sinha