Abstract: The invention provides for a method of attaching printhead integrated circuitry to a carrier. The method includes scanning a wafer having a number of circuitry dies formed thereon to demarcate respective dies, aligning a die picker with a dice on the wafer according to a wafer substrate mapping scheme, and removing the dice from the wafer with the die picker. The method further includes the steps of transporting the dice to a placement station operatively positioning the carrier, aligning the dice with the carrier; and heat bonding the dice to the carrier.

Abstract: The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.

Abstract: Provided is a method for laminating a carrier for printhead integrated circuits. The carrier includes a plurality of fiducials. The method includes the steps of receiving the carrier in a cradle platform, aligning each said fiducial with respective fiducials in a lamina having a series of such holes therein, and bonding the aligned lamina to the carrier, so that a printing fluid is able to pass through the laminated apertures after such bonding.

Abstract: The invention provides for a die picker for picking printhead integrated circuitry from a wafer. The picker includes a wafer platform having a displacement actuator to displace said platform which operatively receives the wafer, and a picker head having a vacuum mechanism to lift a dice of the circuitry from said wafer. The picker also includes an alignment sensor configured to detect a position of the dice on the wafer, and a controller arranged in control signal communication with the displacement actuator, the picker head and the sensor to facilitate aligning the wafer with the picker head, and to pick the dice from the wafer with the head for transport to a transfer apparatus.

Abstract: The invention provides for a safety system for a measuring apparatus for measuring positions of integrated circuits on an integrated circuit carrier positioned, in use, in a working enclosure of the apparatus. The safety system includes a sensor arrangement for sensing an operational status of the measuring apparatus, and an emergency cut-off configured to deactivate the measuring apparatus automatically when an undesired operational status is sensed by the sensor arrangement. A control system is connected to the sensor arrangement and the emergency cut-off to activate the emergency cut-off on receipt of a predetermined signal from the sensor arrangement.

Abstract: Provided is a method for testing integrity of a base for printhead integrated circuits. The base has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The method includes the steps of engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner, charging the base with pressurized fluid until a predetermined pressure is reached, and monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base.

Abstract: The invention relates to a measuring apparatus. The apparatus includes a housing assembly that defines an enclosure, a control system mounted in the housing assembly, and an operator interface mounted on the housing assembly and connected to the control system to allow an operator to control the measuring apparatus. The apparatus also includes a measuring table assembly mounted in the housing assembly and configured to receive a nest assembly supporting an integrated circuit carrier carrying a number of integrated circuits, and a camera assembly mounted in the housing assembly and configured to generate image data representing the integrated circuit carrier and the integrated circuits. The camera assembly is connected to the control system which is configured to carry out a positional analysis on the integrated circuit carrier and the integrated circuits to determine at least one of positions of the integrated circuits on the carrier and relative positions of consecutive integrated circuits.

Abstract: Provided is an assembler for assembling a carrier for supporting printhead integrated circuits. The carrier has upper and lower parts that are operatively fastened together. The assembler includes a support structure configured to support the lower part in a pre-fastened position, and a holding mechanism arranged on the support structure for holding the upper part in a pre-fastened position. The assembler also includes a displacement mechanism arranged on the support structure for displacing the holding mechanisms to bring the parts into operative registration with each other, and a fastening apparatus for fastening the parts together.

Abstract: A pneumatic assembly for a pressure decay tester of printhead integrated circuits includes a pressurized air supply. A pneumatic clamping arrangement is in fluid communication with the pressurized air supply for clamping a carrier for the printhead integrated circuits such that the carrier is in fluid communication with the printhead integrated circuits. A valve arrangement applies a predetermined pressure to the carrier. A sensing arrangement senses a static pressure in the carrier. A control system is in communication with the clamping, valve and sensing arrangements to control operation thereof and to generate a discernible signal representing said static pressure such that a decay in said static pressure can be determined.

Abstract: The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together.

Abstract: The invention relates to a bonding apparatus for bonding a carrier sheet used for carrying printhead integrated circuits to a carrier base. The apparatus includes a support assembly configured to receive and support the carrier base, and a lamination head arranged on the support assembly and configured to bond the carrier sheet to the carrier base. Further included are a conformal material supply mechanism arranged on the support assembly and configured to interpose a conformal material between the surface and the head prior to bonding, and a controller to control operation of the lamination head and the supply mechanism to facilitate bonding of the carrier sheet to the carrier base.

Abstract: Provided is a leak tester for a carrier for printhead integrated circuits. The carrier has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The tester includes a support assembly that includes at least one receptacle shaped and configured to receive at least one respective carrier, and a pressurized fluid supply arranged on the support assembly and configured to supply pressurized fluid to the fluid inlets, the pressurized fluid supply incorporating a sealing mechanism configured to engage the fluid inlets in a sealing manner.

Abstract: This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

Abstract: Provided is an alignment mechanism for aligning a lamination film with a carrier substructure prior to laminating the film to the substructure to form a carrier for integrated circuits. The substructure and the lamination film define complementary perforations and a plurality of respective fiducials. The alignment mechanism includes a sensor arrangement configured to detect the fiducials in the lamination film and substructure and a displacement mechanism configured to displace the lamination film with respect to the substructure to align the perforations of the film and substructure respectively according to alignment of their fiducials so that a printing fluid can pass through the perforations in the film and the substructure of the carrier. The mechanism also includes a controller configured to control operation of the sensor arrangement and the displacement mechanism.