Abstract: Advanced packaging techniques are utilized to provide updated packaging for optical transmitters and receivers. In particular, the hybrid integrated circuit (HIC) used to form either the transmitter or receiver circuitry in the prior art has been replaced by a plastic dual-in-line package (DIP). The DIP includes specialized leads (prongs) formed through the short end of the DIP to provide direct connection to the optical device. These end-prong leads thus significantly decrease the parasitic capacitance associated with conventional DIP connections. A capacitor may be molded into the DIP across the power supply leads to provide filtering for the package. Thermal dissipation is provided by two separate means in this package.

Abstract: Disclosed is a connector module for making electrical contact between two essentially parallel boards which include contact pads on the edges. The connector includes at least one conductive member adapted to extend from a pad on one board to a corresponding pad on the other board. The connector also includes an insulating support member formed to extend from the top of one board, around the edge of that board, and to the top of the other board. This support member fixes the distance between the boards, permits the conductive members to make electrical contact for test purposes prior to clamping, and provides an appropriate clamping force for the connection to the first board.

Abstract: A circuit board connector (14) is assembled to a printed wiring board (11) by first aligning a plurality of leads (18) by urging them into spaced guide grooves (49) of a workholder (41). The spacing of the guide grooves (49) corresponds to the spacing of terminals, also referred to as solder lands (19) on the printed wiring board (11). Within the guide grooves (49) the leads (18) are retained against a possible, lateral resilient stress while a deformable material, such as a solder, is formed across the leads and into spaces between the leads (18). The solder temporarily retains the spacing between the leads while the leads are removed from the workholder and become aligned with the lands (19). During the assembly of the connector (14) to the printed wiring board (11), the leads become resiliently deflected perpendicularly to the plane of the printed wiring board (11). The deflection generates a resilient force which frictionally urges the leads and the lands into contact with each other.