Patents by Inventor William H. Jenson

William H. Jenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low viscosity, thermoplastic modified, low CTE thermosetting polyester encapsulants for microelectronics
    Patent number: 5475040
    Abstract: Filled, thermoplastic-modified thermosetting polyester resin formulations are provided as encapsulants for microelectronics devices. The polyester encapsulant formulations include either a low profile thermoplastic resin additive or a combination of polyethylene and a low shrink thermoplastic additive. In preferred embodiments the polyester encapsulant formulations are of low viscosity and can be utilized in various pressure molding protocols. The encapsulant matrix is characterized by a low coefficient of thermal expansion, very low shrinkage, low modulus, and good thermal conductivity. Microelectronics devices encapsulated with the polyester resin formulation exhibit good resistance to moisture related and stress-induced failure.
    Type: Grant
    Filed: June 14, 1994
    Date of Patent: December 12, 1995
    Assignee: Thermoset Plastics, Inc.
    Inventors: William L. Jamison, William H. Jenson, George E. Sears, Jr.