Patents by Inventor William H. Knopf

William H. Knopf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Extrusion die and process for thickness control
    Patent number: 4517145
    Abstract: An improved extrusion die employing proximity sensors to directly measure the actual die gap during extrusion is disclosed. The proximity sensor may be a capacitance-effect, or optical-effect sensor. Manual and automated closed-loop methods of operation are also disclosed.
    Type: Grant
    Filed: November 7, 1983
    Date of Patent: May 14, 1985
    Assignee: American Hoechst Corporation
    Inventor: William H. Knopf