Abstract: A locking apparatus for blind fasteners providing improved yield and fatigue performance of the blind fasteners is disclosed. The locking apparatus utilizes a locking collar which will slide over the fastener stem and within the tubular rivet sleeve of the fastener without preforming into the locking groove on the stem. The locking collar is formed so that upon the pulling of the stem during installation of the blind fastener, specially formed tapered regions in the locking collar then adjacent the locking groove on the stem cause the region of the locking collar immediately thereabove to be encouraged tightly inward against the locking groove to provide a particularly tight fit in the locking groove. In an alternate embodiment, the locking collar is formed so that upon pulling of the stem during installation of the blind fastener, a specially formed locking collar buckles inward to pack tightly into the locking groove.

Abstract: A current metering circuit is configured as a single stage charge pump for limiting the current level applied to the tunneling regions of an integrated circuit, nonvolatile, floating gate memory cell. The current metering circuit includes a storage capacitor which has one plate pumped by a periodic signal. The other plate of the capacitor is charged from a voltage that is boot-strapped from the voltage that presently exists across the active tunneling region. More particularly, a high voltage is applied to the drain of a transistor whose gate is connected to the tunneling region. The source of this transistor is coupled to a plate of the storage capacitor. This source develops a voltage equal to the present voltage across the load less the turnon threshold of the transistor. When the periodic signal goes low, the storage capacitor is charged from the voltage appearing at the source of this transistor.

Abstract: This invention relates to novel tetrapeptide adamantyl amides that are useful in the treatment of hypertension.

Abstract: An integrated testing apparatus provides bidirectional coupling of a high voltage either from an internal source on an integrated circuit to a first external pin on the integrated circuit package, or to the output point of said internal source of high voltage from a voltage source external to the integrated circuit package that is coupled to said first external pin, said coupling occurring in response to an enabling signal externally impressed on a second external pin on said integrated circuit package. The testing apparatus is substantially transparent to normal integrated circuit operation when said enabling signal is removed from said second external pin.

Abstract: An integrated circuit system for generating a regulated high voltage tunneling pulse whose voltage level varies as a function of the voltage level needed to initiate tunneling of electrons across one or more dielectric gaps between respective first and second regions. The voltage level of initial electron tunneling is compared with a predetermined voltage margin so as to cause said generated tunneling voltage pulse to have a voltage level equal to the sum of said detected tunneling voltage and said voltage margin. The tunneling voltage pulse is then maintained substantially at this level for a predetermined duration before the tunneling pulse is discharged.

Abstract: Nonvolatile, integrated metal-oxide semiconductor random access memory systems utilizing integrated floating gate circuit elements, and integrated means for the generation and control of high voltages in the provision of self-contained, nonvolatile electrically-alterable static RAM circuit systems.

Abstract: The invention provides certain substituted tryptophan derivatives of Formula I which are useful for alleviating or reducing angiotensin related hypertension in hypertensive mammals.

Abstract: Integrated circuit system for generating a rise-time regulated and level controlled high voltage pulse utilizing a plurality of diode-connected stages driven by capacitively coupled low voltage clocks. The maximum output voltage may be controlled by a gated diode reference device, which provides a reference voltage independent of power supply voltage. A feedback circuit may be provided which controls the high voltage rise time by modulating the effective low voltage clock amplitude driving the high voltage generator. A MOS logic level interface circuit may also be provided for sensing achievement of the predetermined high voltage level.

Abstract: Nonvolatile, integrated metal-oxide semiconductor random access memory systems utilizing integrated floating gate circuit elements, and integrated means for the generation and control of high voltages in the provision of self-contained, nonvolatile electrically-alterable static RAM circuit systems.

Abstract: A process for forming an electrical contact region between layers of polysilicon with an integral polysilicon resistor during the fabrication of MOS integrated circuits is disclosed. The contact region which does not require critical alignments, may be formed directly over an active channel or buried (substrate) contact. A silicon nitride mask is formed at the location of the contact region on the first polysilicon layer thereby allowing a thick oxide to be grown on the remainder of the substrate. After removal of the silicon nitride mask, a second polysilicon layer is formed which contacts the first layer at the contact region and defines the resistor. A doping step is used to establish the resistance of the resistor. The process permits the fabrication, by way of example, of a static (bistable) MOS memory cell employing polysilicon loads with an area of approximately 1.5 mils.sup.2.

Abstract: An integrated circuit, metal-oxide-semiconductor (MOS) static random-access memory (RAM) with a power-down mode is described. The bistable memory cells employed in the memory include low conductivity, depletion mode transistors used as loads. "Zero" threshold voltage devices are employed on a low body-effect substrate to permit the powering-down of many circuits in the memory without affecting circuit performance. Several circuits employing these zero threshold devices are described.

Abstract: A process and method for accurately defining polycrystalline silicon patterns from a masking member. The critical dimensions of the silicon patterns are controlled by a diffusion step. Self-limiting etching is achieved through use of an etchant which discriminates between doped and undoped polycrystalline silicon. The process which provides significant advantages in production processing, permits fabrication of narrower gates and smoother edges on elongated silicon strips.

Abstract: A process for fabricating narrow silicon members from a polycrystalline silicon layer, such as gates for MOS field-effect transistors. The edge of a mask is used to define a gap which exposes a narrow line on the underlying silicon layer. A doped region is formed in the silicon layer through the gap and then the layer is selectively etched. The critical dimensions of the fabricated silicon members are determined by the extent of diffusion of the dopant and are substantially independent of masking tolerances.