Patents by Inventor William H. Sisson

William H. Sisson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board with multiple layer interconnect and method of manufacture
    Patent number: 7474537
    Abstract: A circuit board includes a substrate defining a substantially planar surface, a first electrical component, a second electrical component, and an interconnect. The first electrical component is coupled to the substrate. The second electrical component is spaced from the first electrical component and is coupled to the substrate. The interconnect is formed on the substantially planar surface of the substrate and extends between the first electrical component and the second electrical component. The interconnect is formed by at least two layers of a conductive material.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: January 6, 2009
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Mark D. Johnson, Michael G. Kelly, Jeffrey P. Tobin, William H. Sisson
  • System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry
    Patent number: 7359198
    Abstract: A method for cooling a circuit comprises generating movement of fluid along a path through a closed-loop system. The method further comprises inducing turbulence in the fluid by movement of at least a portion of a turbulence-inducing device arranged in the path, and dissipating thermal energy from the circuit by the fluid. A system comprises a circuit, and a closed-loop cooling system comprising fluid for cooling the circuit and at least one active turbulence-inducing device. In one embodiment, the turbulence-inducing device is a microelectromechanical system (MEMS) device. In one embodiment, the MEMS device is solely responsible for bulk fluid movement through the closed-loop cooling system.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: April 15, 2008
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Michael G. Kelly, Mark D. Johnson, William H. Sisson, Jeffrey P. Tobin
  • Circuit board with multiple layer interconnect and method of manufacture
    Publication number: 20070047213
    Abstract: A circuit board includes a substrate defining a substantially planar surface, a first electrical component, a second electrical component, and an interconnect. The first electrical component is coupled to the substrate. The second electrical component is spaced from the first electrical component and is coupled to the substrate. The interconnect is formed on the substantially planar surface of the substrate and extends between the first electrical component and the second electrical component. The interconnect is formed by at least two layers of a conductive material.
    Type: Application
    Filed: August 30, 2005
    Publication date: March 1, 2007
    Inventors: Mark D. Johnson, Michael G. Kelly, Jeffrey P. Tobin, William H. Sisson