Abstract: In an example, an optoelectronic module may include a housing enclosing at least one optical transmitter or receiver and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage a cage sized and shaped to receive the housing. The optoelectronic module may include a bail rotatably coupled to the housing, and the bail may be configured to actuate the slider when the bail is rotated. The optoelectronic module may include a retainer configured to engage with the housing and the bail to retain the bail in a fixed position with respect to the housing.

Abstract: An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver, a release mechanism configured to engage with a cage sized and shaped to receive the housing, and a retainer including at least one occlusion member sized and shaped to be positioned inside a port of the optoelectronic module and a sleeve member configured to slide with respect to the occlusion member.

Abstract: In an example, an optoelectronic module may include a housing enclosing at least one optical transmitter or receiver and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage a cage sized and shaped to receive the housing. The optoelectronic module may include a bail rotatably coupled to the housing, and the bail may be configured to actuate the slider when the bail is rotated. The optoelectronic module may include a retainer configured to engage with the housing and the bail to retain the bail in a fixed position with respect to the housing.

Abstract: An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver, a release mechanism configured to engage with a cage sized and shaped to receive the housing, and a retainer including at least one occlusion member sized and shaped to be positioned inside a port of the optoelectronic module and a sleeve member configured to slide with respect to the occlusion member.

Abstract: An example method of assembling an optoelectronic assembly may include aligning a receptacle with a sleeve that may have a radial flange and with a ferrule that may have a light propagation axis. The method may include axially displacing one or more of the receptacle, the sleeve, and the ferrule such that the receptacle may be positioned at least partially within the sleeve and may at least partially surround the ferrule. The method may include aligning a fiber stub that may have a fiber stub pigtail and a fiber stub flange with the receptacle. The method may include axially displacing one or both of the fiber stub and the receptacle such that the fiber stub may be positioned in close proximity with the ferrule. The method may include coupling the sleeve via the radial flange and the fiber stub via the fiber stub flange with a retention device.

Abstract: An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage a cage sized and shaped to receive the housing. The optoelectronic module may include a bail rotatably coupled to the housing. The bail may be configured to actuate the slider when the bail is rotated. The optoelectronic module may include a retainer including an occlusion member sized and shaped to be positioned inside a port of the optoelectronic module. The retainer may define a surface configured to engage with the bail.

Abstract: An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver, a slider configured to move with respect to the housing, and a retainer configured to engage both the slider and the housing to retain the slider with respect to the housing. The slider may include a resilient tab and at least one protrusion configured to engage a cage sized and shaped to receive the housing. The retainer may include a first end portion configured to abut the resilient tab of the slider.

Abstract: An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver, and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage with a cage sized and shaped to receive the housing, and a retainer configured to engage both the slider and the housing to retain the slider with respect to the housing. The retainer may include a first protrusion sized and shaped to be positioned in a slot defined by the housing, and a second protrusion sized and shaped to abut the slider.

Abstract: An example method of assembling an optoelectronic assembly may include aligning a receptacle with a sleeve that may have a radial flange and with a ferrule that may have a light propagation axis. The method may include axially displacing one or more of the receptacle, the sleeve, and the ferrule such that the receptacle may be positioned at least partially within the sleeve and may at least partially surround the ferrule. The method may include aligning a fiber stub that may have a fiber stub pigtail and a fiber stub flange with the receptacle. The method may include axially displacing one or both of the fiber stub and the receptacle such that the fiber stub may be positioned in close proximity with the ferrule. The method may include coupling the sleeve via the radial flange and the fiber stub via the fiber stub flange with a retention device.

Abstract: An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage a cage sized and shaped to receive the housing. The optoelectronic module may include a handle coupled to the slider to actuate the slider, and a retainer configured to engage both the handle and the housing to retain the handle and the slider with respect to the housing. The retainer may include at least one occlusion member sized and shaped to be positioned inside a port of the optoelectronic module.

Abstract: An alignment connector for an optoelectronic module can include: a front end having a first gripper arm and a second gripper arm with an alignment connector aperture between the first gripper arm and the second gripper arm; a base having a bottom surface and a receptacle surface; the back end having a first back wall and a second back wall with a back gap therebetween; and a ferrule receptacle extending to a medial region where the alignment connector aperture extends from, and including a portion of the receptacle surface, the ferrule receptacle being defined by a first side wall having a first latch arm and a second side wall having a second latch arm. The alignment connector can be included in a module with a bail or pull-tab. Alternatively, the first gripper arm and second gripper arm can be mounted directly to a module housing.

Abstract: A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

Abstract: An example optoelectronic module may include an optical subassembly (OSA), an optical port block, a housing, and a holder. The OSA may be configured to convert between optical and electrical signals. The optical port block may be attached to the OSA and may be configured to optically align a fiber optic cable with the OSA. The housing may be configured to substantially enclose the OSA and the optical port block. The holder may be configured to couple the OSA and the optical port block to the housing. The holder may be detachably coupled to the optical port block and fixedly coupled to the housing.

Abstract: An optoelectronic system includes an optoelectronic module and a heat sink. The optoelectronic module includes a housing and first and second housing slide locks. The first and second housing slide locks extend outward from opposite sides of the housing. The heat sink includes a heat sink bottom, first and second heat sink legs, and first and second heat sink slide locks. The first and second heat sink legs extend downward from opposite ends of the heat sink bottom. The first and second heat sink slide locks extend inward from the first and second heat sink legs. The heat sink bottom is configured to be in thermal contact with a housing top of the housing. Each of the first and second heat sink slide locks is configured to be respectively disposed beneath the first and second housing slide locks when the heat sink is removably secured to the housing.

Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

Abstract: A ferrule-to-lens latch mechanism includes a cover movable with respect to a housing of an optical assembly between an open position in which a cavity defined by the housing is visible and a closed position in which the cavity is covered by the cover. A lens is positioned in the cavity and has one or more guide pins which are visible when the cover is in the open position prior to mating a ferrule to the lens. A spring clip coupled to the housing and positioned in the cavity is configured to allow insertion and removal of the ferrule from the cavity when the cover is in the open position and may bias the ferrule against the lens when the ferrule is mated to the lens. When the ferrule is mated to the lens, the cover may cooperate with the spring clip to inhibit removal of the ferrule.

Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

Abstract: A ferrule-to-lens latch mechanism includes a cover movable with respect to a housing of an optical assembly between an open position in which a cavity defined by the housing is visible and a closed position in which the cavity is covered by the cover. A lens is positioned in the cavity and has one or more guide pins which are visible when the cover is in the open position prior to mating a ferrule to the lens. A spring clip coupled to the housing and positioned in the cavity is configured to allow insertion and removal of the ferrule from the cavity when the cover is in the open position and may bias the ferrule against the lens when the ferrule is mated to the lens. When the ferrule is mated to the lens, the cover may cooperate with the spring clip to inhibit removal of the ferrule.