Patents by Inventor William H. Wiley

William H. Wiley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9227388
    Abstract: Devices and methods for attaching support frames to substrates to form articles such as implantable stent grafts can include providing a first laminate material; positioning a support frame onto the first laminate material, the support frame having a pre-formed shape; positioning a second laminate material onto the support frame and first laminate material; bonding the first laminate material to the second laminate material; cutting the first and second laminate materials along opposite sides of the support frame thereby forming a laminated support frame having generally the same pre-formed shape of the support frame; and attaching the laminated support frame to a substrate.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: January 5, 2016
    Assignee: W. L. GORE & ASSOCIATES, INC.
    Inventors: Brandon C. Hedberg, William H. Wiley, Edward E. Shaw
  • Publication number: 20130306232
    Abstract: Devices and methods for attaching support frames to substrates to form articles such as implantable stent grafts.
    Type: Application
    Filed: October 10, 2012
    Publication date: November 21, 2013
    Applicant: W. L. GORE & ASSOCIATES, INC.
    Inventors: Brandon C. Hedberg, William H. Wiley, Edward E. Shaw
  • Patent number: 6984242
    Abstract: The present invention is directed to implantable medical device assemblies. The assemblies are primarily used to introduce and deposit implantable medical devices in the vasculatures of implant recipients. The principle implantable medical device used in the assembly is an expandable element in the form of an endovascular device. The expandable element is maintained in a compacted configuration during introduction of the device into the vasculature with a confinement means. The expandable element is released from the confinement means at an implantation site with a control line. The control line has high tensile strength, high modulus, structural rigidity, and low compressibility. These features of the control line provide a practitioner with tactile feedback of the release of the expandable element from the confinement means. The tactile feedback is present during the entire deployment of the expandable element.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: January 10, 2006
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Carey V. Campbell, William H. Wiley
  • Publication number: 20040122503
    Abstract: The present invention is directed to implantable medical device assemblies. The assemblies are primarily used to introduce and deposit implantable medical devices in the vasculatures of implant recipients. The principle implantable medical device used in the assembly is an expandable element in the form of an endovascular device. The expandable element is maintained in a compacted configuration during introduction of the device into the vasculature with a confinement means. The expandable element is released from the confinement means at an implantation site with a control line. The control line has high tensile strength, high modulus, structural rigidity, and low compressibility. These features of the control line provide a practitioner with tactile feedback of the release of the expandable element from the confinement means. The tactile feedback is present during the entire deployment of the expandable element.
    Type: Application
    Filed: December 20, 2002
    Publication date: June 24, 2004
    Inventors: Carey V. Campbell, William H. Wiley
  • Patent number: 6546292
    Abstract: A layered electrode having a large tissue contact area of the portion of the electrode that is electrically active and providing low polarization losses, high pacing impedance and low chronic stimulation voltage. In a fundamental embodiment, the electrode tip has an outer layer of microporous material which is permeable to conductive body fluids which covers a layer of insulating material which is provided with at least one perforation through the thickness of the material. The at least one perforation provides a localized, high current density path. Both of these layers in turn cover the exterior surface of an electrically conductive, preferably metal, electrode body.
    Type: Grant
    Filed: November 4, 1998
    Date of Patent: April 8, 2003
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Bruce M. Steinhaus, Louis J. Smith, William H. Wiley, Robert C. Krall