Abstract: A signal acquisition probing system uses an optical cavity to acquire a signal under test. The probing system has an optical transmitter and receiver that are coupled to the optical cavity via an optical transmission system. The optical cavity has an electrode structure having apertures formed in the optical cavity that are parallel to propagation path of the optical signal within the cavity. A modulated optical signal is generated by the optical cavity in response to the signal under test creating an electro-magnetic field distribution in electro-optic material in the optical cavity that overlaps the optical path of the optical signal propagating in the optical cavity which varies the index of refraction of electro-optic material in the optical path. The signal acquisition probing system is connected to a measurement instrument to form a voltage measurement system.

Abstract: An electrode structure for electro-optic material used in optical cavities is described. The electrode structure has first and second apertures disposed generally parallel to an optical signal propagating within the electro-optic material. Electrically conductive material is disposed within the apertures coupling an electrical signal to the electro-optic material.

Abstract: A variable attenuation signal acquisition probing system and voltage measurement system uses an optical cavity to acquire a signal under test. The probing system has an optical transmitter and receiver that are coupled to the optical cavity via an optical transmission system. The optical cavity has an electrode structure having apertures formed in the optical cavity that are parallel to propagation path of the optical signal within the cavity. A modulated optical signal is generated by the optical cavity in response to the signal under test creating an electromagnetic field distribution in electro-optic material in the optical cavity that overlaps the optical path of the optical signal propagating in the optical cavity which varies the index of refraction of electro-optic material in the optical path. Changes in the polarization state of the optical signal attenuates the magnitude of the output electrical signal of the optical receiver.

Abstract: A signal acquisition probing system uses a micro-cavity laser to acquire an electrical signal from a device under test. The micro-cavity laser has VCSEL gain mediums and an electro-optic optical resonant cavity. The micro-cavity laser is pumped by an external laser source and generates polarized frequency modulated optical signals derived from the device under test electrical signal creating an electro-magnetic field distribution in electro-optic material in the micro-cavity laser that overlaps the optical path of the polarized optical signals propagating in the electro-optic material. The polarized frequency modulated optical signals are coupled to an optical receiver which converts the polarized frequency modulated optical signals to an electrical signal. The electrical signal is coupled to measurement test instrument for processing and displaying of the electrical signal.

Abstract: An optically pumped micro-cavity laser has an optical gain cavity and an optical resonant cavity. The optical gain cavity has a gain medium disposed that generates an optical output in response to an optical pump signal. The optical resonant cavity has an electro-optic material in which is disposed an electrode structure with first and second apertures disposed generally parallel to an optical signal propagating within the electro-optic material. Electrically conductive material is disposed within the apertures coupling an electrical signal to the optical cavity.

Abstract: An optical cavity having an electro-optic material disposed between opposing optically reflective material has an electrode structure with first and second apertures disposed generally parallel to an optical signal propagating within the electro-optic material. Electrically conductive material is disposed within the apertures coupling an electrical signal to the optical cavity.

Abstract: A method and apparatus adapted to calibrate a test probe and oscilloscope system such that loading effects of the probe are substantially removed from the measurement.

Abstract: A method and apparatus adapted to calibrate a test probe and oscilloscope system such that loading effects of the probe are substantially removed from the measurement.

Abstract: A surface mount probe point socket has a housing with base and a socket extending from the base. The base has a length and width sufficient for attaching the housing to a circuit trace using an electrically conductive material while adding minimal inductance and capacitance to the circuit trace. The socket has a height and diameter for supporting a measurement probe in the housing while adding minimal inductance and capacitance to the measurement probe. A probe point contact is disposed in the bore of the socket for receiving a probe point disposed in the end of the measurement probe to secure the probe in the housing. Two surface mount probe point sockets may be joined together with an alignment gage and attached to adjacent circuit traces to produce a surface mount probe point socket system for differential measurement probes.

Abstract: A surface mount probe point socket has a housing with base and a socket extending from the base. The base has a length and width sufficient for attaching the housing to a circuit trace using an electrically conductive material while adding minimal inductance and capacitance to the circuit trace. The socket has a height and diameter for supporting a measurement probe in the housing while adding minimal inductance and capacitance to the measurement probe. A probe point contact is disposed in the bore of the socket for receiving a probe point disposed in the end of the measurement probe to secure the probe in the housing. Two surface mount probe point sockets may be joined together with an alignment gage and attached to adjacent circuit traces to produce a surface mount probe point socket system for differential measurement probes.

Abstract: A low temperature co-fired ceramic substrate structure has first and second conductive patterns respectively disposed on first and second dielectric layers with the conductive patterns being separated by the first dielectric layer. The first conductive pattern has a first conductive element functioning as a first plate of a capacitor and a second conductive element functioning as a voltage potential lead for an integrated circuit device. The second conductive pattern is positioned below the first conductive pattern and functions as the second plate of the capacitor and as a thermally conductive heat transfer layer for the integrated circuit device. At least a first thermally conductive via is formed between the top and bottom surfaces of the second dielectric layer and below the second conductive element with the via thermally coupled to the second conductive pattern. The thermal via or vias may be thermally coupled to a heat sink disposed adjacent to the bottom surface of the second dielectric layer.

Abstract: A high speed differential attenuator is formed on low temperature co-fired ceramic substrate structure having first and second parallel resistor-capacitor divider networks with each divider network having first and second parallel resistors and capacitors. The substrate has first and second dielectric layers with the top surface of the first dielectric layer having a voltage potential lead formed thereon for receiving an integrated circuit device. Each divider network further has first and second conductive elements formed on the top surface of the first dielectric layer functioning as first capacitive plates for the first and second capacitors. A third conductive element is disposed between the first and second dielectric layers and positioned beneath the first conductive element functioning as the other capacitive plate for the first capacitor.