Abstract: An input device for an electronic device includes a proximity detector and a light source. The light source transmits light to a sensing area, which is reflected back to the proximity detector in the presence of an object in the vicinity of the sensing area, such that the proximity detector can produce an output indicative of a distance of the object from the proximity detector to give rise to a control signal for controlling the device.

Abstract: A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.

Abstract: A camera module may include a substrate, and an image sensor mounted on the substrate. The camera module may also include a housing, and an electromagnetic interference (EMI) shield provided around the image sensor and within the module. The camera module may be particularly suited for use in a mobile telephone, for example.

Abstract: A lens assembly includes a lens mount, an image sensor, and an optical filter. An optical filter holder is secured to the lens mount and has an upper contact surface which abuts the optical filter and a lower contact surface which abuts the image sensor to thereby align the optical filter and the image sensor with an optical axis.

Abstract: A camera module includes a substrate with a cavity therein. A processor is located in the cavity, and wire bonding is for connecting the processor to the substrate. An imaging module is adapted to overlay the processor in the cavity and rest on at least part of the edge of the cavity. Wire bonding is for connecting the imaging module to the substrate and the processor. The cavity includes a longitudinal cutout section adapted to accommodate at least some wire bonding for connecting the processor to the substrate or associated surface mount components.

Abstract: Drilling fluid systems comprising sized graphite particle mixtures.