Patents by Inventor William Hamburgen

William Hamburgen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080030078
    Abstract: Apparatus and associated method and computer program products involve a highly efficient uninterruptible power distribution architecture to support modular processing units. As an illustrative example, a modular processing unit includes an corresponding uninterruptible power system in which only one AC-to-DC rectification occurs between the utility AC grid and the processing circuit (e.g., microprocessor) loads. In an illustrative data center facility, a power distribution architecture includes a modular array of rack-mountable processing units, each of which has processing circuitry to handle network-related processing tasks. Associated with each modular processing unit is an uninterruptible power supply (UPS) to supply operating power to the network processing circuitry. Each UPS includes a battery selectively connectable across a DC bus, and a AC-to-DC rectifier that converts an AC input voltage to a single output voltage on the DC bus.
    Type: Application
    Filed: June 1, 2007
    Publication date: February 7, 2008
    Applicant: Exaflop LLC
    Inventors: William Whitted, Montgomery Sykora, Ken Krieger, Benchiao Jai, William Hamburgen, Jimmy Clidaras, Donald Beaty, Gerald Aigner
  • Publication number: 20070281639
    Abstract: A system can include an enclosure having an exterior surface and an interior region that is characterized by a width and a length that is longer than the width; a plurality of trays mounted in racks that line a majority of each side of the length of the interior region and that define an aisle therebetween which is suitable for passage by one or more human occupants; cooling coils configured to capture heat generated by the plurality of trays and exhaust the heat outside the interior region; a plurality of connections on the exterior surface for supplying electrical power to the plurality of trays, supplying cooling fluid to the cooling coils, and for receiving cooling fluid discharged from the cooling coils; and doors at either end of the aisle configured and positioned to facilitate emergency egress from the enclosure by a human occupant.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 6, 2007
    Inventors: Jimmy Clidaras, William Hamburgen, Andrew Carlson, Steven Y. Chow, Winnie Leung, Montgomery Sykora, Donald L. Beaty
  • Patent number: 7302751
    Abstract: A method of fabricating a radio frequency identification (RFID) antenna on a substrate is disclosed. The antenna is fabricated on a substrate that includes already fabricated RFID chips. The substrate is connected with a carrier substrate and singulated to separate the plurality of RFID chips into a plurality of diesites. The antenna is connected to a RFID chip in an assembly order to form an a RFID tag. The method is repeated such that each successively connected antenna overlaps a previously connected antenna.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: December 4, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: William Hamburgen
  • Patent number: 7183902
    Abstract: A Very Local Area Network (VLAN) comprises a power strip device having an electrical connector for connection to an AC power supply line and one or more surge protectors and line filters. Multiple electrical power outlet sockets receive plugs from electrical appliances. A communications pathway interconnects the multiple electrical power outlet sockets to enable communication between appliances connected to the sockets. Electronics configure appliances as they are connected to the sockets to enable them to communicate over the communications pathway.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: February 27, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: William Hamburgen, Keith E. Moore
  • Publication number: 20060107525
    Abstract: An aspect of the present invention is a method of creating alignment holes in a multilayer structure that includes depositing a metal layer in contact with a polymer layer of material, patterning the metal layer and creating alignment holes in the multilayer structure based on the patterned metal layer.
    Type: Application
    Filed: November 22, 2004
    Publication date: May 25, 2006
    Inventor: William Hamburgen
  • Publication number: 20060071761
    Abstract: A Very Local Area Network (VLAN) comprises a power strip device having an electrical connector for connection to an AC power supply line and one or more surge protectors and line filters. Multiple electrical power outlet sockets receive plugs from electrical appliances. A communications pathway interconnects the multiple electrical power outlet sockets to enable communication between appliances connected to the sockets. Electronics configure appliances as they are connected to the sockets to enable them to communicate over the communications pathway.
    Type: Application
    Filed: September 30, 2004
    Publication date: April 6, 2006
    Inventors: William Hamburgen, Keith Moore
  • Publication number: 20050241146
    Abstract: A method of fabricating a rat's nest radio frequency identification (RFID) antenna is disclosed. The antennas are fabricated on a substrate that includes already fabricated RFID chips. The antennas can be loop antennas. An antenna is connected to a RFID chip in an assembly order and a RFID tag including the antenna and the RFID Chip is removed from a carrier substrate connected with the substrate in a disassembly order. The assembly order and the disassembly order prevent the overlapping antennas from being damaged or entangled upon disassembly. The antenna can be substantially larger than the RFID chip it is connected with and the resulting RFID tag can have a small size and small cost with the enhanced performance of a larger antenna without having to resort to a large off-chip external antenna or a large on-chip antenna that would increase chip area and cost.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 3, 2005
    Inventor: William Hamburgen
  • Publication number: 20050237319
    Abstract: A lifetime of a display is optimized by determining whether to control at least a portion of a display based on a lifetime metric. A plurality of display control options is identified in response to determining to control the portion of the display, and one of the display control options is selected.
    Type: Application
    Filed: April 23, 2004
    Publication date: October 27, 2005
    Inventors: Parthasarathy Ranganathan, William Hamburgen, Robert Mayo, Ken Nicholas
  • Publication number: 20030135288
    Abstract: Energy-aware software control in a computer system requires a display capable of supporting control of individual portions thereof so at to reduce its energy consumption. The energy-aware software control involves profiling screen usage patterns and their impact on the energy consumption by the display. The profiling results in an energy model. A determination is made when to prompt the energy-aware software control of the display. As well, a determination is made as to which screen portions of the display and what display parameters to control based on the energy model. Then, for each portion of the display to be controlled, controlling its display parameters, wherein the screen portions are controlled to attain energy conservation.
    Type: Application
    Filed: December 27, 2001
    Publication date: July 17, 2003
    Applicant: Compaq Information Technologies Group, L.P.
    Inventors: Parthasarathy Ranganathan, James Gettys, William Hamburgen
  • Patent number: 5240549
    Abstract: A fixture (10) for bonding multiple components together includes a bottom plate (20), a middle plate (22) and a top plate (24). The plates (20), (22) and (24) are aligned by dowels (26) and clamps (30). Bottom plate (20) has a rectangular pocket (32) for holding heat sink (14) and alignment pins (34) for locating plastic pin grid array (PPGA) package (12) over the heat sink (14). An annular projection (40) covered with a conformal pad (42) extends from bottom surface (44) of the middle plate (22). Dowel (50) extends through openings (46) and (36) in the top and middle plates (24) and (22) to apply pressure to chip (16). A first spring (56) is mounted on the dowel (50) and compressed between the top plate (24) and a snap ring (58) to provide pressure from the dowel (50) on the chip (16). A second, larger diameter spring (60) is compressed between the middle plate (22) and the top plate (24) to provide pressure from the middle plate (22) on the PPGA (12).
    Type: Grant
    Filed: June 28, 1991
    Date of Patent: August 31, 1993
    Assignee: Digital Equipment Corporation
    Inventors: William Hamburgen, John S. Fitch